MPC8241LVR200D Freescale Semiconductor, MPC8241LVR200D Datasheet - Page 31

• Manufacturer Part Number: MPC8241LVR200D
• Description: IC MPU 32BIT 200MHZ PPC 357-PBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerPCr

Specifications of MPC8241LVR200D

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 200MHz
• Voltage: 1.8V
• Mounting Type: Surface Mount
• Package / Case: 357-PBGA
• Processor Series: MPC8xxx
• Core: 603e
• Maximum Clock Frequency: 200 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: 0 C
• Core Size: 32 Bit
• Program Memory Size: 32KB
• Cpu Speed: 200MHz
• Digital Ic Case Style: BGA
• No. Of Pins: 357
• Supply Voltage Range: 1.14V To 1.26V
• Operating Temperature Range: 0°C To +105°C
• Family Name: MPC82XX
• Device Core: PowerQUICC II
• Device Core Size: 32b
• Frequency (max): 200MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.8V
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 357
• Package Type: BGA
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

5
This section details package parameters, pin assignments, and dimensions.
5.1
The MPC8241 uses a 25 mm × 25 mm, cavity up, 357-pin plastic ball grid array (PBGA) package. The
package parameters are as follows.
Freescale Semiconductor
Package Description
Package outline
Interconnects
Pitch
Solder balls
Solder ball diameter
Maximum module height
Co-planarity specification
Maximum force
Package Parameters for the MPC8241
TDI, TMS
TDO
TDO
TCK
MPC8241 Integrated Processor Hardware Specifications, Rev. 10
Figure 23. Test Access Port Timing Diagram
1.27 mm
ZP (PBGA)—62 Sn/36 Pb/2 Ag—available only in Rev B parts
ZQ (Thick substrate thick mold cap PBGA)—62 Sn/36 Pb/2 Ag
VR (Lead free version of package)—95.5 Sn/4.0 Ag/0.5 Cu
2.52 mm
0.15 mm
6.0 lbs. total, uniformly distributed over package (8 grams/ball)
25 mm × 25 mm
357
0.75 mm
12
13
Input Data Valid
10
Output Data Valid
11
Package Description
31