MPC8541EVTAPF Freescale Semiconductor, MPC8541EVTAPF Datasheet - Page 21

IC MPU POWERQUICC III 783-FCPBGA

MPC8541EVTAPF

Manufacturer Part Number
MPC8541EVTAPF
Description
IC MPU POWERQUICC III 783-FCPBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC IIIr
Datasheets

Specifications of MPC8541EVTAPF

Processor Type
MPC85xx PowerQUICC III 32-Bit
Speed
833MHz
Voltage
1.2V
Mounting Type
Surface Mount
Package / Case
783-FCPBGA
Core Size
32 Bit
Program Memory Size
64KB
Cpu Speed
833MHz
Digital Ic Case Style
BGA
No. Of Pins
783
Supply Voltage Range
1.14V To 1.26V
Rohs Compliant
Yes
Family Name
MPC85XX
Device Core
PowerQUICC III
Device Core Size
32b
Frequency (max)
833MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.2V
Operating Supply Voltage (max)
1.26V
Operating Supply Voltage (min)
1.14V
Operating Temp Range
0C to 105C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
783
Package Type
FCBGA
For Use With
MPC8548CDS - DEV TOOLS CDS FOR 8548CWH-PPC-8540N-VE - KIT EVAL SYSTEM MPC8540
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Compliant

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7.2
Table 17
8
This section provides the AC and DC electrical characteristics for three-speed, 10/100/1000, and MII
management.
8.1
The electrical characteristics specified here apply to all GMII (gigabit media independent interface), the
MII (media independent interface), TBI (ten-bit interface), RGMII (reduced gigabit media independent
interface), and RTBI (reduced ten-bit interface) signals except MDIO (management data input/output) and
MDC (management data clock). The RGMII and RTBI interfaces are defined for 2.5 V, while the GMII
and TBI interfaces can be operated at 3.3 V or 2.5 V. Whether the GMII, MII, or TBI interface is operated
at 3.3 or 2.5 V, the timing is compliant with the IEEE 802.3 standard. The RGMII and RTBI interfaces
follow the Hewlett-Packard reduced pin-count interface for Gigabit Ethernet Physical Layer Device
Specification Version 1.2a (9/22/2000). The electrical characteristics for MDIO and MDC are specified in
Section 8.3, “Ethernet Management Interface Electrical
8.1.1
All GMII, MII, TBI, RGMII, and RTBI drivers and receivers comply with the DC parametric attributes
specified in
RTBI receiver may exceed the potential of the receiver’s power supply (for example, a GMII driver
powered from a 3.6-V supply driving V
for dissimilar GMII driver and receiver supply potentials is implicit in these specifications. The RGMII
and RTBI signals are based on a 2.5-V CMOS interface voltage as defined by JEDEC EIA/JESD8-5.
Freescale Semiconductor
Ethernet: Three-Speed, MII Management
MPC8541E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
provides the AC timing parameters for the DUART interface of the MPC8541E.
DUART AC Electrical Specifications
Three-Speed Ethernet Controller (TSEC)
(10/100/1000 Mbps)—GMII/MII/TBI/RGMII/RTBI Electrical
Characteristics
TSEC DC Electrical Characteristics
Table 18
Minimum baud rate
Maximum baud rate
Oversample rate
Notes:
1. Actual attainable baud rate is limited by the latency of interrupt processing.
2. The middle of a start bit is detected as the 8
3. Guaranteed by design.
bit. Subsequent bit values are sampled each 16
Parameter
and
Table
Table 17. DUART AC Timing Specifications
19. The potential applied to the input of a GMII, MII, TBI, RGMII, or
f
CCB_CLK
OH
f
CCB_CLK
into a GMII receiver powered from a 2.5-V supply). Tolerance
Value
16
/ 1048576
/ 16
th
sampled 0 after the 1-to-0 transition of the start
th
Characteristics.”
sample.
baud
baud
Unit
Ethernet: Three-Speed, MII Management
Notes
1, 3
2, 3
3
21

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