MPC8541ECVTALF Freescale Semiconductor, MPC8541ECVTALF Datasheet - Page 54

• Manufacturer Part Number: MPC8541ECVTALF
• Description: IC MPU POWERQUICC III 783-FCPBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8541ECVTALF

• Processor Type: MPC85xx PowerQUICC III 32-Bit
• Speed: 667MHz
• Voltage: 1.2V
• Mounting Type: Surface Mount
• Package / Case: 783-FCPBGA
• For Use With: MPC8548CDS - DEV TOOLS CDS FOR 8548CWH-PPC-8540N-VE - KIT EVAL SYSTEM MPC8540
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -

Package and Pin Listings
Figure 39
Figure 40
14 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions.
14.1
The package parameters are as provided in the following list. The package type is 29 mm × 29 mm, 783
flip chip plastic ball grid array (FC-PBGA).
54
Die size
Package outline
Interconnects
Pitch
Minimum module height 3.07 mm
Maximum module height 3.75 mm
Solder Balls
Ball diameter (typical)
MPC8541E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
Package Parameters for the MPC8541E FC-PBGA
shows the PCI input AC timing conditions.
shows the PCI output AC timing conditions.
High-Impedance
Figure 40. PCI Output AC Timing Measurement Condition
Figure 39. PCI Input AC Timing Measurement Conditions
Output Delay
Input
CLK
Output
CLK
8.7 mm × 9.3 mm × 0.75 mm
29 mm × 29 mm
783
1 mm
62 Sn/36 Pb/2 Ag
0.5 mm
t
PCIVKH
t
PCKHOZ
t
PCKHOV
t
PCIXKH
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