MPC8349EVVAJFB Freescale Semiconductor, MPC8349EVVAJFB Datasheet - Page 76
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MPC8349EVVAJFB
Manufacturer Part Number
MPC8349EVVAJFB
Description
IC MPU POWERQUICC II 672-TBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC II PROr
Datasheet
1.MPC8349EVVAJFB.pdf
(87 pages)
Specifications of MPC8349EVVAJFB
Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
533MHz
Voltage
1.2V
Mounting Type
Surface Mount
Package / Case
672-TBGA
Processor Series
MPC8xxx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
MPC8349E-MITXE
Maximum Clock Frequency
533 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
I/o Voltage
1.8 V, 2.5 V, 3.3 V
Minimum Operating Temperature
0 C
Core Size
32 Bit
Program Memory Size
64KB
Cpu Speed
533MHz
Embedded Interface Type
I2C, SPI, USB, UART
Digital Ic Case Style
TBGA
No. Of Pins
672
Rohs Compliant
Yes
For Use With
MPC8349E-MITX-GP - KIT REFERENCE PLATFORM MPC8349EMPC8349E-MITXE - BOARD REFERENCE FOR MPC8349MPC8349EA-MDS-PB - KIT MODULAR DEV SYSTEM MPC8349E
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
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Thermal
(edge) of the package is approximately the same as the local air temperature near the device. Specifying
the local ambient conditions explicitly as the board temperature provides a more precise description of the
local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using the following equation:
where:
When the heat loss from the package case to the air can be ignored, acceptable predictions of junction
temperature can be made. The application board should be similar to the thermal test condition: the
component is soldered to a board with internal planes.
20.2.3
To determine the junction temperature of the device in the application after prototypes are available, use
the thermal characterization parameter (
temperature at the top center of the package case using the following equation:
where:
The thermal characterization parameter is measured per the JESD51-2 specification using a 40 gauge type
T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
20.2.4
Some application environments require a heat sink to provide the necessary thermal management of the
device. When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case
thermal resistance and a case-to-ambient thermal resistance:
76
T
T
R
P
T
T
Ψ
P
A
J
J
T
θ
D
D
JT
JA
= junction temperature (°C)
= junction temperature (°C)
= ambient temperature for the package (°C)
= thermocouple temperature on top of package (°C)
= power dissipation in the package (W)
= power dissipation in the package (W)
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Experimental Determination of Junction Temperature
Heat Sinks and Junction-to-Case Thermal Resistance
= junction-to-ambient thermal resistance (°C/W)
= junction-to-ambient thermal resistance (°C/W)
T
T
R
J
J
θ
JA
= T
= T
= R
A
T
+ (R
+ (
θ
JC
Ψ
θ
+ R
JT
JA
× P
Ψ
× P
θ
CA
JT
D
D
) to determine the junction temperature and a measure of the
)
)
Freescale Semiconductor