MPC8248CVRTIEA Freescale Semiconductor, MPC8248CVRTIEA Datasheet - Page 12

• Manufacturer Part Number: MPC8248CVRTIEA
• Description: IC MPU POWERQUICC II 516-PBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of MPC8248CVRTIEA

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 400MHz
• Voltage: 1.5V
• Mounting Type: Surface Mount
• Package / Case: 516-PBGA
• Core Size: 32 Bit
• Program Memory Size: 32KB
• Cpu Speed: 400MHz
• Embedded Interface Type: I2C, JTAG, SPI, UART
• Digital Ic Case Style: BGA
• No. Of Pins: 516
• Rohs Compliant: Yes
• For Use With: CWH-PPC-8248N-VE - KIT EVAL SYSTEM QUICCSTART 8248
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -

Thermal Characteristics
4
Table 6
Discussions of each characteristic are provided in sections 4.1 through 4.7. For the these discussions,
P
4.1
An estimation of the chip junction temperature, T
where:
The junction-to-ambient thermal resistance is an industry standard value which provides a quick and easy
estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated
that errors of a factor of two (in the quantity T
4.2
Historically, the thermal resistance has frequently been expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
12
5
D
MPC8272 and MPC8271 only.
= (V
1
2
3
4
Junction-to-ambient—
single-layer board
Junction-to-ambient—
four-layer board
Junction-to-board
Junction-to-case
Junction-to-package top
measured on the top surface of the board near the package.
Method 1012.1).
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written as Psi-JT.
Assumes no thermal vias
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Thermal characterization parameter indicating the temperature difference between package top and the junction
Thermal Characteristics
T
R
P
describes thermal characteristics. Refer to
DD
A
D
θJA
Estimation with Junction-to-Ambient Thermal Resistance
Estimation with Junction-to-Case Thermal Resistance
= ambient temperature (ºC)
= power dissipation in package
× I
= package junction-to-ambient thermal resistance (ºC/W)
T
DD
J
= T
) + PI/O, where PI/O is the power dissipation of the I/O drivers.
3
Characteristic
2
1
A
+ (R
MPC8272 PowerQUICC II™ Family Hardware Specifications, Rev. 2
4
θJA
× P
D
)
Table 6. Thermal Characteristics
J
– T
J
Symbol
, in C can be obtained from the equation:
Table 2
A
R
R
R
R
R
) are possible.
θJA
θJA
θJB
θJC
θJT
for information on a given device’s package.
Value
27
21
19
16
11
8
2
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Freescale Semiconductor
Natural convection
Natural convection
Air Flow
1 m/s
1 m/s
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