CY8C20446-24LQXIT Cypress Semiconductor Corp, CY8C20446-24LQXIT Datasheet - Page 28
![no-image](/images/manufacturer_photos/0/1/179/cypress_semiconductor_corp_sml.jpg)
CY8C20446-24LQXIT
Manufacturer Part Number
CY8C20446-24LQXIT
Description
IC CAPSENSE AP 16K 2048B 32UQFN
Manufacturer
Cypress Semiconductor Corp
Series
CapSense® Controllersr
Specifications of CY8C20446-24LQXIT
Applications
Capacitive Sensing
Core Processor
M8C
Program Memory Type
FLASH (16 kB)
Controller Series
CY8C20xx6
Ram Size
2K x 8
Interface
I²C, SPI
Number Of I /o
28
Voltage - Supply
1.71 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
32-UQFN Exposed Pad, 32-HUQFN, 32-SQFN
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Technology
CMOS
Processing Unit
Microprocessor
Operating Supply Voltage (min)
1.71V
Operating Supply Voltage (typ)
1.8/2.5/3.3/5V
Operating Supply Voltage (max)
5.5V
Package Type
QFN EP
Screening Level
Industrial
Pin Count
32
Mounting
Surface Mount
Rad Hardened
No
Processor Series
CY8C20x46
Core
M8C
Development Tools By Supplier
CY3280-20X66
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Compliant, Lead free / RoHS Compliant
Important Notes
■
■
Thermal Impedances
Table 33. Thermal Impedances per Package
Solder Reflow Peak Temperature
This table lists the minimum solder reflow peak temperature to achieve good solderability.
Table 34. Solder Reflow Peak Temperature
Document Number: 001-12696 Rev. *D
Notes
11. T
12. To achieve the thermal impedance specified for the QFN package, the center thermal pad must be soldered to the PCB ground plane.
13. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5
For information on the preferred dimensions for mounting QFN packages, see the following Application Note at
http://www.amkor.com/products/notes_papers/MLFAppNote.pdf.
Pinned vias for thermal conduction are not required for the low power PSoC device.
Refer to the solder manufacturer specifications.
J
= T
A
+ Power x θ
24 QFN
32 QFN
48 QFN
48 SSOP
Package
48 SSOP
Package
16 QFN
24 QFN
32 QFN
48 QFN
16 QFN
JA
.
[12]
[12]
[12]
Minimum Peak Temperature
Figure 18. 48-Pin (7x7 mm) QFN
Typical θ
32.69
20.90
19.51
17.68
69
240
240
240
220
240
o
C/W
o
o
o
o
o
o
o
o
o
C
C
C
C
C
C/W
C/W
C/W
C/W
JA
[11]
[13]
CY8C20x36/46/66, CY8C20396
Maximum Peak Temperature
o
C with Sn-Pb or 245 ± 5
001-13191 *C
260
260
260
260
260
o
o
o
o
o
C
C
C
C
C
o
C with Sn-Ag-Cu paste.
Page 28 of 34
[+] Feedback