CY8C20346-24LQXIT Cypress Semiconductor Corp, CY8C20346-24LQXIT Datasheet - Page 28

• Manufacturer Part Number: CY8C20346-24LQXIT
• Description: IC CAPSENSE AP 16K 2048B 24UQFN
• Manufacturer: Cypress Semiconductor Corp
• Series: CapSense® Controllersr

Specifications of CY8C20346-24LQXIT

• Applications: Capacitive Sensing
• Core Processor: M8C
• Program Memory Type: FLASH (16 kB)
• Controller Series: CY8C20xx6
• Ram Size: 2K x 8
• Interface: I²C, SPI
• Number Of I /o: 20
• Voltage - Supply: 1.71 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-UQFN Exposed Pad, 24-HUQFN
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Technology: CMOS
• Processing Unit: Microprocessor
• Operating Supply Voltage (min): 1.71V
• Operating Supply Voltage (typ): 1.8/2.5/3.3/5V
• Operating Supply Voltage (max): 5.5V
• Package Type: QFN EP
• Screening Level: Industrial
• Pin Count: 24
• Mounting: Surface Mount
• Rad Hardened: No
• Processor Series: CY8C20x46
• Core: M8C
• Development Tools By Supplier: CY3280-20X66
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Compliant, Lead free / RoHS Compliant

Important Notes
■
■
Thermal Impedances
Table 33. Thermal Impedances per Package
Solder Reflow Peak Temperature
This table lists the minimum solder reflow peak temperature to achieve good solderability.
Table 34. Solder Reflow Peak Temperature
Document Number: 001-12696 Rev. *D
Notes
11. T
12. To achieve the thermal impedance specified for the QFN package, the center thermal pad must be soldered to the PCB ground plane.
13. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5
For information on the preferred dimensions for mounting QFN packages, see the following Application Note at
http://www.amkor.com/products/notes_papers/MLFAppNote.pdf.
Pinned vias for thermal conduction are not required for the low power PSoC device.
Refer to the solder manufacturer specifications.
J
= T
A
+ Power x θ
24 QFN
32 QFN
48 QFN
48 SSOP
Package
48 SSOP
Package
16 QFN
24 QFN
32 QFN
48 QFN
16 QFN
JA
.
[12]
[12]
[12]
Minimum Peak Temperature
Figure 18. 48-Pin (7x7 mm) QFN
Typical θ
32.69
20.90
19.51
17.68
69
240
240
240
220
240
o
C/W
o
o
o
o
o
o
o
o
o
C
C
C
C
C
C/W
C/W
C/W
C/W
JA
[11]
[13]
CY8C20x36/46/66, CY8C20396
Maximum Peak Temperature
o
C with Sn-Pb or 245 ± 5
001-13191 *C
260
260
260
260
260
o
o
o
o
o
C
C
C
C
C
o
C with Sn-Ag-Cu paste.
Page 28 of 34
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