XC2V6000-4FFG1152C Xilinx Inc, XC2V6000-4FFG1152C Datasheet - Page 290
![no-image](/images/no-image-200.jpg)
XC2V6000-4FFG1152C
Manufacturer Part Number
XC2V6000-4FFG1152C
Description
IC VIRTEX-II FPGA 6M 1152-FCBGA
Manufacturer
Xilinx Inc
Series
Virtex™-IIr
Datasheet
1.XC2V250-4FGG256C.pdf
(318 pages)
Specifications of XC2V6000-4FFG1152C
Number Of Labs/clbs
8448
Total Ram Bits
2654208
Number Of I /o
824
Number Of Gates
6000000
Voltage - Supply
1.425 V ~ 1.575 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
1152-BBGA, FCBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Logic Elements/cells
-
Other names
122-1358
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XC2V6000-4FFG1152C
Manufacturer:
Xilinx Inc
Quantity:
10 000
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BF957 Flip-Chip BGA Package
As shown in
package. Pins in each of these devices are the same, except for the pin differences in the XC2V2000 device shown in the
No Connect column. Following this table are the
Table 14: BF957 — XC2V2000, XC2V3000, XC2V4000, and XC2V6000
DS031-4 (v3.5) November 5, 2007
Product Specification
Bank
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
Table
14, XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Virtex-II devices are available in the BF957
IO_L04N_0/VREF_0
IO_L21P_0/VREF_0
IO_L27P_0/VREF_0
IO_L03N_0/VRP_0
IO_L03P_0/VRN_0
Pin Description
IO_L01N_0
IO_L01P_0
IO_L02N_0
IO_L02P_0
IO_L04P_0
IO_L05N_0
IO_L05P_0
IO_L06N_0
IO_L06P_0
IO_L19N_0
IO_L19P_0
IO_L20N_0
IO_L20P_0
IO_L21N_0
IO_L22N_0
IO_L22P_0
IO_L23N_0
IO_L23P_0
IO_L24N_0
IO_L24P_0
IO_L25N_0
IO_L25P_0
IO_L26N_0
IO_L26P_0
IO_L27N_0
IO_L29N_0
IO_L29P_0
IO_L30N_0
IO_L30P_0
BF957 Flip-Chip BGA Package Specifications (1.27mm
www.xilinx.com
Pin Number
Virtex-II Platform FPGAs: Pinout Information
G24
G23
G22
G21
G20
H23
H22
E25
B29
C27
D26
D25
A28
A27
B27
B26
K20
K19
C26
C24
D24
D23
E24
E23
A26
A25
H21
H20
B25
B23
F24
F23
J22
J21
No Connect in XC2V2000
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
pitch).
Module 4 of 4
198
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