GM-SMT2-S2-1010-TR Kycon, GM-SMT2-S2-1010-TR Datasheet

Telecom & Ethernet Connectors 10P10C R/A SMT SHLD LOPRO BLK W/POST TR

GM-SMT2-S2-1010-TR

Manufacturer Part Number

GM-SMT2-S2-1010-TR

Description

Telecom & Ethernet Connectors 10P10C R/A SMT SHLD LOPRO BLK W/POST TR

Manufacturer

Kycon

Datasheet

1.GM-SMT2-S2-1010-TR.pdf (1 pages)

Specifications of GM-SMT2-S2-1010-TR

Usoc Codes

RJ11

Mounting Style

SMD/SMT

Gender

Female

Shielding

Shielded

Current Rating

1.5 A

Contact Plating

Gold over Nickel

Housing Material

Polybutylene Terephthalate Thermoplatic

Color

Black

Mounting Angle

Right

Lead Free Status / Rohs Status

Lead free / RoHS Compliant

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REVISION

Part Number

GM-SMT2-S2-1010

GM-SMT2-S2-1010-50

GM-SMT2-S2-1010-TR

GM-SMT2-S2-10-50TR

Ø3.10

Ø1.70

1

1

DATE

DESCRIPTION

15.74±0.20

11.43

18.50

1.27 Typ.

t_gold

Flash

50u"

Flash

50u"

REVISED BY

DRAWN BY

Packaging

Tray

Tray

Tape & Reel

Tape & Reel

10

APPROVED BY

10

CHECKED BY

UNITS

DATE

Recommended PCB Layout

1.27 Typ.

0.76

10

8.13

Category 5 100MHz Bandwidth Performance

Attenuation @ 100MHz less than 0.13dB

Performance meets near end crosstalk (NEXT)

Shielded types offer 20dB shielding from

(top view)

Requirements of -40dB @ 100MHz per

Approved Category 5 cable (GA27-3773-1)

EIA/TIA 568A in applications where UL

is used

30MHz to 300MHz

18.65±0.20

16.35

11.43

11.43

3.05

1

2.50

3.12

Ø3.30

CSA Certified File No. LR78160

UL Recognized File No. E134345

Housing Material:

Oxygen Index- 36%

Poly mass- 2.4 g

Recommended Reflow Temperature:

Design meets UL 1863 Sec. 8

Shield Material:

Contact Material: phosphor bronze

Contact Plating Options:

Insulation Resistance:

Dielectric Withstanding Voltage:

Contact Resistance:

Current Rating: 1.5 Amps

Durability Rating:

Operating Temperature:

Standard: 0.0001" Nickel

high temp. thermoplastic,

UL 94V-0 rated, black color

260°C max.

Electrical Probe and Sec. 20

copper alloy, 0.20mm thick,

nickel plated 90u" min,

50: 0.0001" Nickel Plating,

500 Megohms min.

20 milliohms max.

1000 mating cycles min.

(reflow process compatible)

230°C for 30 seconds,

Child Finger test requirements

1000V rms, 60Hz

-40°C to +85°C

Selective Plating 0.000050"

Plating, Selective Plating

Gold Flash on Contact

Area, Tin/Lead on Termination End

Gold on Contact Area to

Comply with FCC Requirements

Under No. 47 C.F.R. Part 68,

Subpart F, Tin/Lead on

Termination End

Tolerances

X.X ± 0.2

X.XX ± 0.10

Unless Stated

Otherwise

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