XA3S400-4FTG256I Xilinx Inc, XA3S400-4FTG256I Datasheet - Page 7

• Manufacturer Part Number: XA3S400-4FTG256I
• Description: IC FPGA SPARTAN-3 400K 256-FTBGA
• Manufacturer: Xilinx Inc
• Series: Spartan™-3 XAr

Specifications of XA3S400-4FTG256I

• Number Of Logic Elements/cells: 8064
• Number Of Labs/clbs: 896
• Total Ram Bits: 294912
• Number Of I /o: 173
• Number Of Gates: 400000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 256-LBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Pb-Free Packaging
For additional information on Pb-free packaging, see
Packages.
Table 6: Package Types and Number of Pins
Additional Resources
•
•
•
Revision History
The following table shows the revision history for this document:
DS314 (v1.3) June 18, 2009
Product Specification
XA3S50
XA3S200
XA3S400
XA3S1000
XA3S1500
10/18/04
12/20/04
10/27/06
11/28/06
11/12/07
01/25/08
06/18/09
Device
Date
DS099, Spartan-3 FPGA Family Data Sheet
UG331, Spartan-3 Generation FPGA User Guide
UG332, Spartan-3 Generation Configuration User Guide
R
-4
Package Type
Speed Grade
Version
Device Type
Example:
Speed Grade
1.2.1
1.2.2
1.2.3
1.0
1.1
1.2
1.3
Performance
Standard
Initial Xilinx release.
Multiple text edits throughout.
Updated IO standards
Table
Changed order of explanations in
Changed all values for the Block RAM (bits) column and two values for the XA3S1000 row in
Changed XA3S1500 Q-Grade Maximum in
Added UG331 and UG332 to
XA3S50 -4 PQ G 208 Q
4, and
VQG100
TQG144
PQG208
FTG256
FGG456
FGG676
Table
5.
100-pin Very Thin Quad Flat Pack (VQFP)
144-pin Thin Quad Flat Pack (TQFP)
208-pin Plastic Quad Flat Pack (PQFP)
256-ball Fine-Pitch Thin Ball Grid Array
(FTBGA)
456-ball Fine-Pitch Ball Grid Array (FBGA)
676-ball Fine-Pitch Ball Grid Array (FBGA)
Package Type / Number of Pins
(Table
XAPP427
www.xilinx.com
2), and link to Spartan-3 Data Sheet, added XA3S1500, TQG144, FGG676,
"Additional Resources"
Temperature Range:
Q-Grade = Automotive Extended (T
I-Grade = Automotive Industrial (T
Number of Pins
Pb-free
Table 6
: Implementation and Solder Reflow Guidelines for Pb-Free
for TQG144 and PQG208.
Table
Description
5.
section.
Introduction and Ordering Information
J
J
= –40°C to +100°C)
= –40°C to +125°C)
Q Q-Grade (– 40°C to +125°C)
I
Temperature Range ( T
DS314-1_03_100808
I-Grade (– 40°C to +100°C)
Table
J
1.
)
7