XC3S200AN-4FTG256C Xilinx Inc, XC3S200AN-4FTG256C Datasheet - Page 2

• Manufacturer Part Number: XC3S200AN-4FTG256C
• Description: IC SPARTAN-3AN FPGA 200K 256FTBG
• Manufacturer: Xilinx Inc
• Series: Spartan™-3ANr

Specifications of XC3S200AN-4FTG256C

• Total Ram Bits: 294912
• Number Of Logic Elements/cells: 4032
• Number Of Labs/clbs: 448
• Number Of I /o: 195
• Number Of Gates: 200000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 256-LBGA
• No. Of Logic Blocks: 4032
• No. Of Gates: 200000
• No. Of Macrocells: 4032
• Family Type: Spartan-3AN
• No. Of Speed Grades: 4
• No. Of I/o's: 195
• Package: 256FTBGA
• Family Name: Spartan®-3AN
• Device Logic Units: 4032
• Device System Gates: 200000
• Maximum Internal Frequency: 667 MHz
• Typical Operating Supply Voltage: 1.2 V
• Maximum Number Of User I/os: 195
• Ram Bits: 294912
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 122-1553

Package Substrate Change for Spartan-3A and Spartan-3AN Devices
Key Dates and Ordering Information
Xilinx will begin to cross-ship the 2-layer package on or after January 10, 2009. At that time, shipment of
either or both 2-layer and 4-layer substrate material may occur.
Response
Note: In accordance with JESD46-C, this change is deemed accepted by the customer if no
acknowledgement is received within 30 days from this notice.
No response is required. For additional information or questions, please contact
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Additional Documentation
Qualification Report (RPT112):
https://secure.xilinx.com/webreg/clickthrough.do?cid=113468
Additional Information for XCN08014: Q&A (XTP036):
https://secure.xilinx.com/webreg/clickthrough.do?cid=113469
Revision History
The following table shows the revision history for this document.
2
10/20/08
Date
Version
1.0
18683.
Revision
Initial release.
www.xilinx.com
XCN08014 (v1.0) October 20, 2008
Xilinx Technical
Support.