PLCC-44P-T-SMT-P FCI, PLCC-44P-T-SMT-P Datasheet

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PLCC-44P-T-SMT-P

Manufacturer Part Number
PLCC-44P-T-SMT-P
Description
IC & Component Sockets 44P PLCC SMT W/PEG
Manufacturer
FCI
Datasheet

Specifications of PLCC-44P-T-SMT-P

Product
PLCC Sockets
Pitch
2.54
Number Of Positions / Contacts
44
Contact Plating
Tin over Nickel
Mounting Style
SMD/SMT
Features
Low Profile
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
1.0
2.0
3.0
4.0
TITLE
PLCC (Plastic Leaded Chip Carrier) Surface Mount Sockets
Copyright
Form E-3334
Rev E
4.1
OBJECTIVE
SCOPE
This specification is applicable to the termination characteristics of the surface mount PLCC sockets
accepting EIA/JEDEC Standard plastic J-leaded chip carrier IC’s in lead counts of 20, 28, 32, 44, 52, 68, and
84.
GENERAL
APPLICABLE DOCUMENTS
4.3
4.4
4.2
This specification defines the performance, test, quality, and reliability requirements of the PLCC SMT
connector products (FCI USA product series PLCC-XXP-T-SMT and PLCC-XXP-T-SMT-SOD).
FCI
SPECIFICATIONS
EIA and MILITARY STANDARDS
4.2.1
4.2.2
4.2.3
4.2.4
4.2.5
FEDERAL SPECIFICATIONS
4.3.1
4.3.2
OTHER STANDARDS AND SPECIFICATIONS
4.4.1
Engineering Drawings: 59000, 59001, 59002
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
EIA 364-XX:
MIL-C-45662:
MIL-STD-202:
MIL-STD-883:
MIL-STD-1344: Test Methods for Electronic Connectors
QQ-N-290:
QQ-B-750:
UL-94:
TYPE
Objective
Scope
General
Applicable Documents
Requirements
Electrical Characteristics
Mechanical Characteristics
Environmental Conditions
Quality Assurance Provisions
Phosphor Bronze Alloy Strip
Nickel Plating (Electrodeposited)
Tests for Flammability of Plastic Materials
PRODUCT SPECIFICATION
Test Methods for Electronic Component Parts and Connectors
Test Methods for Electronic and Electical Component Parts
Test Methods and Procedures for Microelectronics
Equipment Calibration
PDM: Rev:B
STATUS:
NUMBER
PAGE
AUTHORIZED BY
CLASSIFICATION
D. Horchler
Released
1 of 11
UNRESTRICTED
GS-12-158
Printed: Sep 15, 2009
REVISION
DATE
31 Aug 06
GS-01-001
B
.

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PLCC-44P-T-SMT-P Summary of contents

Page 1

... This specification defines the performance, test, quality, and reliability requirements of the PLCC SMT connector products (FCI USA product series PLCC-XXP-T-SMT and PLCC-XXP-T-SMT-SOD). 2.0 SCOPE This specification is applicable to the termination characteristics of the surface mount PLCC sockets accepting EIA/JEDEC Standard plastic J-leaded chip carrier IC’s in lead counts of 20, 28, 32, 44, 52, 68, and 84. 3.0 GENERAL 1 ...

Page 2

... TYPE TITLE PLCC (Plastic Leaded Chip Carrier) Surface Mount Sockets 4.5 FCI SPECIFICATIONS 4.5.1 BUS-03-113: Inductance Measurement 4.5.2 BUS-03-114: Capacitance Measurement 4.5.3 BUS-03-115: Insulation Resistance 4.5.4 BUS-15-002: Nickel Finish 4.5.5 BUS-15-006: Electrodeposited 93-7 and 90-10 Tin-Lead 4.5.6 BUS-16-010: Phosphor Bronze Strip 4 ...

Page 3

... TYPE TITLE PLCC (Plastic Leaded Chip Carrier) Surface Mount Sockets 6.0 ELECTRICAL CHARACTERISTICS 6.1 CURRENT RATING The maximum current rating based upon a 30°C temperature rise over ambient is 1.0 Amp AC/DC per contact, with ambient temperature of 25°C ± 5°C. 6.2 ...

Page 4

... MATING FORCE After PLCC sockets are preconditioned (mate and unmate, 5 cycles) with a nominal size PLCC gage, the insertion force shall be 10 ounces maximum per contact when mated with a PLCC gage at maximum insertion rate of .5 inch per minute. 7.4 UNMATING FORCE After PLCC sockets are preconditioned (mate and unmate, 5 cycles) with a nominal size PLCC gage, the withdrawal force shall be 0 ...

Page 5

... TYPE TITLE PLCC (Plastic Leaded Chip Carrier) Surface Mount Sockets Testing and acceptance per BUS-19-040/A, Plating Adhesion Bend Test (equivalent to ASTM B571- 84). 7.7 MECHANICAL SHOCK – MIL-STD-1344, METHOD 2004, TEST g’s for 0.11 ms half-sine. B. Shocks: 3 shocks in both directions along each of 3 orthogonal axes (18 total). ...

Page 6

... TYPE TITLE PLCC (Plastic Leaded Chip Carrier) Surface Mount Sockets B. Temperature range: -55 to +125°C. C. Samples: mated during exposure D. Sockets shall show no cracking or damage to insulator or leads, Contact Resistance maximum allowable change of 6 milliohms when tested per paragraph 6.2. 8.3 SOLDERABILITY TEST Testing and acceptance per BUS-19-002/D, Solderability (equivalent to MIL-STD-202, Method 208) ...

Page 7

... TYPE TITLE PLCC (Plastic Leaded Chip Carrier) Surface Mount Sockets 9.2 SAMPLE QUANTITIES Sample quantities for the respective test groups are as follows: NUMBER OF TEST GROUP CONNECTORS 9.3 ACCEPTANCE 9.3.1 Electrical and mechanical requirements placed on test samples as indicated in paragraphs 6.0 and 7.0 shall be established from test data using appropriate statistical techniques or shall otherwise be customer specified, and all samples tested in accordance with this product specification shall meet the stated requirements ...

Page 8

... TYPE TITLE PLCC (Plastic Leaded Chip Carrier) Surface Mount Sockets TABLE 1 - QUALIFICATION TESTING TEST Examination of Product Contact Resistance Low Level Insulation Resistance Dielectric Withstanding Voltage Capacitance Inductance Contact Retention Durability Mating/Unmating Force Normal Force Plating Adhesion Mechanical Shock Vibration Humidity Temperature ...

Page 9

... TYPE TITLE PLCC (Plastic Leaded Chip Carrier) Surface Mount Sockets CONTACT RESISTANCE MEASUREMENT POINTS Notes: 1) The contact resistance shall be measured between points B and C. The formula is RBC = RAD – (RAB +RCD). 2) The outside dimensions of the modified IC Device should meet the appropriate JEDEC specification. ...

Page 10

... TYPE TITLE PLCC (Plastic Leaded Chip Carrier) Surface Mount Sockets Notes: 1) Dim. “X” is measured across the outside edges of the terminal seating slots. 2) Dim. “Y” is half the minimum width dimension of the IC Device specified in the appropriate JEDEC specification (minimum normal force value is for minimum sized device). ...

Page 11

... TYPE TITLE PLCC (Plastic Leaded Chip Carrier) Surface Mount Sockets REV PAGE 1 All Release of Preliminary Specification 2 All Revised format to be consistent with GS-01-001, and change BERG, Dupont, etc. references to FCI. Change document number prefix from GES to GS. A All New Release B ALL ...

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