EP3C80F780C8 Altera, EP3C80F780C8 Datasheet - Page 56
![IC CYCLONE III FPGA 80K 780FBGA](/photos/6/72/67270/544-780-fbga_sml.jpg)
EP3C80F780C8
Manufacturer Part Number
EP3C80F780C8
Description
IC CYCLONE III FPGA 80K 780FBGA
Manufacturer
Altera
Series
Cyclone® IIIr
Datasheets
1.EP3C5F256C8N.pdf
(5 pages)
2.EP3C5F256C8N.pdf
(34 pages)
3.EP3C5F256C8N.pdf
(66 pages)
4.EP3C5F256C8N.pdf
(14 pages)
5.EP3C5F256C8N.pdf
(76 pages)
Specifications of EP3C80F780C8
Number Of Logic Elements/cells
81264
Number Of Labs/clbs
5079
Total Ram Bits
2810880
Number Of I /o
429
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
780-FBGA
For Use With
544-2411 - KIT DEV NIOS II CYCLONE III ED.
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Number Of Gates
-
Other names
544-2522
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
EP3C80F780C8N
Manufacturer:
ALTERA
Quantity:
380
Part Number:
EP3C80F780C8N
Manufacturer:
ALTERA/阿尔特拉
Quantity:
20 000
Page 56
Testing
Boundary-Scan Test
Other Considerations
Reliability
FPGA Starter Kit
f
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One of the most common board-level tests on the devices in production environment
is the boundary-scan test. The Cyclone III device fully supports IEEE 1149.1 (JTAG)
boundary-scan testing. A boundary-scan test allows you to test pin connections at
board level without using physical test probes while the device is operating normally.
To perform the boundary-scan test, you must have the boundary-scan description
language (BSDL) file of the device.
Use the BSDL files from the Altera website to perform boundary-scan test on
pre-configured Cyclone III devices. For post-configured devices, you must modify the
BSDL file according to the design. Altera provides the BSDLCustomizer tool for you
to regenerate a BSDL file for your post-configured device. The BSDLCustomizer is a
Tool Command Language (Tcl) script that uses the .pin file of the design generated by
the Quartus II software and the BSDL file of the pre-configured device available from
the Altera website to generate another BSDL file with modified port definitions and
boundary-scan cell groups’ attributes.
Take note of some basic rules when dealing with semiconductor devices to maintain
the reliability of the devices.
When handling an In-System Sources and Probes semiconductor device, beware of
the electrostatic discharge (ESD) that can cause immediate functional failure, degrade
I/O performance or decrease long-term reliability of the device.
Exercise care when handling the device by storing the device in an ESD-free
environment and wearing grounds straps.
To ensure reliable device functionality, always operate the device within the
recommended operating conditions, as specified in the
DC and Switching Characteristics
Device operation at the absolute maximum ratings for extended period of time may
damage the device and result in the device not operating properly.
To help you simplify the design process and reduce time-to-market, you can use the
Cyclone III FPGA starter kit as a test and debug platform. The starter kit is easy to use
and includes software, reference designs, cables, and programming hardware.
For more information about the Cyclone III starter kit, refer to the
Starter
Kit.
chapter in volume 2 of the Cyclone III Device Handbook.
Cyclone III Device Datasheet:
© November 2008 Altera Corporation
Cyclone III FPGA
Testing