EP3C55F780I7 Altera, EP3C55F780I7 Datasheet - Page 13
![IC CYCLONE III FPGA 55K 780 FBGA](/photos/6/72/67270/544-780-fbga_sml.jpg)
EP3C55F780I7
Manufacturer Part Number
EP3C55F780I7
Description
IC CYCLONE III FPGA 55K 780 FBGA
Manufacturer
Altera
Series
Cyclone® IIIr
Datasheets
1.EP3C5F256C8N.pdf
(5 pages)
2.EP3C5F256C8N.pdf
(34 pages)
3.EP3C5F256C8N.pdf
(66 pages)
4.EP3C5F256C8N.pdf
(14 pages)
5.EP3C5F256C8N.pdf
(76 pages)
Specifications of EP3C55F780I7
Number Of Logic Elements/cells
55856
Number Of Labs/clbs
3491
Total Ram Bits
2396160
Number Of I /o
377
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
780-FBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Number Of Gates
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
EP3C55F780I7N
Manufacturer:
ALTERA
Quantity:
310
Company:
Part Number:
EP3C55F780I7N
Manufacturer:
ALTERA42
Quantity:
202
Part Number:
EP3C55F780I7N
Manufacturer:
ALTERA/阿尔特拉
Quantity:
20 000
Chapter 1: Cyclone III Device Family Overview
Chapter Revision History
Chapter Revision History
Table 1–7. Chapter Revision History
© December 2009 Altera Corporation
December 2009
July 2009
June 2009
October 2008
May 2008
July 2007
March 2007
Date
Table 1–7
Version
2.2
2.1
2.0
1.3
1.2
1.1
1.0
lists the revision history for this chapter.
Minor text edits.
Minor edit to the hyperlinks.
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Initial release.
Added Table 1–5.
Updated Table 1–1, Table 1–2, Table 1–3, and Table 1–4.
Updated “Introduction”, “Cyclone III Device Family Architecture”, “Embedded
Multipliers and Digital Signal Processing Support ”, “Clock Networks and
PLLs ”, “I/O Features ”, “High-Speed Differential Interfaces ”, “Auto-
Calibrating External Memory Interfaces ”, “Quartus II Software Support”,
“Configuration ”, and “Design Security (Cyclone III LS Devices Only)”.
Removed “Referenced Document” section.
Updated “Increased System Integration” section.
Updated “Memory Blocks” section.
Updated chapter to new template.
Added 164-pin Micro FineLine Ball-Grid Array (MBGA) details to Table 1–2,
Table 1–3 and Table 1–4.
Updated Figure 1–2 with automotive temperature information.
Updated “Increased System Integration” section, Table 1–6, and “High-Speed
Differential Interfaces” section with BLVDS information.
Removed the text “Spansion” in “Increased System.
Integration” and “Configuration” sections.
Removed trademark symbol from “MultiTrack” in “MultiTrack Interconnect”.
Removed registered trademark symbol from “Simulink” and “MATLAB” from
“Embedded Multipliers and Digital.
Signal Processing Support” section.
Added chapter TOC and “Referenced Documents” section.
Changes Made
Cyclone III Device Handbook, Volume 1
1–13