XC3S200AN-4FTG256I Xilinx Inc, XC3S200AN-4FTG256I Datasheet - Page 2

• Manufacturer Part Number: XC3S200AN-4FTG256I
• Description: IC SPARTAN-3AN FPGA 200K 256FTBG
• Manufacturer: Xilinx Inc
• Series: Spartan™-3ANr

Specifications of XC3S200AN-4FTG256I

• Total Ram Bits: 294912
• Number Of Logic Elements/cells: 4032
• Number Of Labs/clbs: 448
• Number Of I /o: 195
• Number Of Gates: 200000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 256-LBGA
• No. Of Logic Blocks: 448
• No. Of Gates: 200000
• No. Of Macrocells: 4032
• Family Type: Spartan-3AN
• No. Of Speed Grades: 4
• No. Of I/o's: 195
• Clock: RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 122-1569

Industry’s first 90nm FPGA with Electronic Serial Numbering
Each FPGA includes a permanent unique Device DNA serial number and Factory Flash ID.
Designers have complete flexibility in implementing highly customized algorithms for both
authentication, as well as non-authentication responses such as limited-functionality,
time-bomb, and self-destruct. This can significantly deter reverse-engineering, cloning,
and overbuilding.
Industry’s Largest On-Chip User Flash
The new Spartan-3AN platform boasts the industry’s largest on-chip user flash with a
capacity of up to 11Mb. It provides simple and secure embedded application storage,
while also enabling advanced real-time control with fine-grained protection, lockdown
and erase features.
Widest Support for I/O Standards
The Spartan-3AN FPGA is especially suitable for display devices supporting both TMDS and
PPDS standards. With support for 26 popular single-ended and differential signaling standards
including LVDS, RSDS, SSTL3 Class I & II, full hot-swap compliance, and pre-engineered
interface IP solutions such as PCI, PCI Express, USB, Firewire, CAN, SPI, and I2C, the
Spartan-3AN platform provides an industry-leading connectivity solution.
Flexible Power-Management Modes
The “Suspend” Mode in Spartan-3AN FPGAs provides a very flexible and effective way to
preserve power. In this mode, the total FPGA power is reduced by more than 40%. The
configuration data as well as flip-flop and RAM values are also maintained. In addition, it
includes a fast wake-up mechanism and system level synchronization across time domains.
Take the Next Step
Visit our website www.xilinx.com/spartan3an or call your local sale office or distributor for
more information about Spartan-3AN FPGAs. To start your design immediately, download
your free ISE WebPACK
FPGAs, order your hardware development board at www.xilinx.com/s3anstarter
* Spartan-3AN platform is pin compatible with Spartan-3A platform supporting platform migration
Device
System Gates
Logic Cells
Dedicated Multipliers
Block RAM Blocks
Block RAM Bits
Distributed RAM Bits
Flash Size Bits
User Flash Bits
DCMs
I/O Standards
Max Differential I/O
Max Single Ended I/O
Device
TQ144 20 x 20 mm
FT256 17 x 17 mm
FG400 21 x 21 mm
FG484 23 x 23 mm
FG676 27 x 27 mm
TM
design tools at www.xilinx.com/ise. To begin evaluating Spartan-3AN
Spartan-3AN FPGA Platform
XC3S50AN
50K
1,584
3
3
54K
11K
1M
627K
2
26
50
108
Package and I/O Offerings
XC3S50AN
108
XC3S200AN
200K
4,032
16
16
288K
28K
4M
2M
4
26
90
195
XC3S200AN
195
XC3S400AN
400K
8,064
20
20
360K
56K
4M
2M
4
26
142
311
XC3S400AN
311
XC3S700AN
700K
13,248
20
20
360K
92K
8M
5M
8
26
165
372
XC3S700AN
372
XC3S1400AN
1400K
25,344
32
32
576K
176K
16M
11M
8
26
227
502
XC3S1400AN
502
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Copyright © 2OO7 Xilinx, Inc. All rights reserved. XILINX, the Xilinx Logo, and other
designated brands included herein are trademarks of Xilinx, Inc. All other trademarks
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Printed in U.S.A. PN 2011
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