EPF10K30RC240-3 Altera, EPF10K30RC240-3 Datasheet - Page 36

IC FLEX 10K FPGA 30K 240-RQFP

EPF10K30RC240-3

Manufacturer Part Number
EPF10K30RC240-3
Description
IC FLEX 10K FPGA 30K 240-RQFP
Manufacturer
Altera
Series
FLEX-10K®r
Datasheet

Specifications of EPF10K30RC240-3

Number Of Logic Elements/cells
1728
Number Of Labs/clbs
216
Total Ram Bits
12288
Number Of I /o
189
Number Of Gates
69000
Voltage - Supply
4.75 V ~ 5.25 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
240-RQFP
Family Name
FLEX 10K
Number Of Usable Gates
30000
Number Of Logic Blocks/elements
1728
# Registers
738
# I/os (max)
189
Frequency (max)
125MHz
Process Technology
CMOS
Operating Supply Voltage (typ)
5V
Logic Cells
1728
Ram Bits
12288
Device System Gates
69000
Operating Supply Voltage (min)
4.75V
Operating Supply Voltage (max)
5.25V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
240
Package Type
RQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
544-2231

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SameFrame
Pin-Outs
36
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
FLEX 10KE devices support the SameFrame pin-out feature for
FineLine BGA packages. The SameFrame pin-out feature is the
arrangement of balls on FineLine BGA packages such that the lower-ball-
count packages form a subset of the higher-ball-count packages.
SameFrame pin-outs provide the flexibility to migrate not only from
device to device within the same package, but also from one package to
another. A given printed circuit board (PCB) layout can support multiple
device density/package combinations. For example, a single board layout
can support a range of devices from an EPF10K10A device in a 256-pin
FineLine BGA package to an EPF10K100A device in a 484-pin
FineLine BGA package.
The Altera software provides support to design PCBs with SameFrame
pin-out devices. Devices can be defined for present and future use. The
Altera software generates pin-outs describing how to lay out a board to
take advantage of this migration (see
Figure 16. SameFrame Pin-Out Example
256-Pin FineLine BGA Package
(Reduced I/O Count or
Logic Requirements)
Designed for 484-PinFineLine BGA Package
FineLine
256-Pin
BGA
Printed Circuit Board
Figure
484-Pin FineLine BGA Package
(Increased I/O Count or
Logic Requirements)
16).
FineLine
484-Pin
BGA
Altera Corporation

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