0W888-002-XTP ON Semiconductor, 0W888-002-XTP Datasheet - Page 30

• Manufacturer Part Number: 0W888-002-XTP
• Description: DSP BELASIGNA 250 AUDIO 64LFBGA
• Manufacturer: ON Semiconductor
• Series: BelaSigna® 250r
• Type: Floating Pointr

Specifications of 0W888-002-XTP

• Interface: I²C, I²S, PCM, SPI, UART
• Clock Rate: 50MHz
• On-chip Ram: 42kB
• Voltage - I/o: 1.0V, 2.0V
• Voltage - Core: 1.00V, 2.00V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 64-LFBGA
• Package: 64LFBGA
• Numeric And Arithmetic Format: Fixed-Point
• Ram Size: 16 KB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Non-volatile Memory: -

E1
e/2
7 X
X
e
8 7 6
0.1
7 X
e
PIN 1 CORNER
VIEW M−M
Z
5
D1
D
4
3 2 1
e/2
A
B
C
D
G
H
E
F
Y
E
64 X
PIN 1 CORNER
PACKAGE DIMENSIONS
b
0.08
0.15
LFBGA 64 BALLS, 7x7
NOTE 3
http://onsemi.com
DETAIL K
Z
Z
CASE 504−01
X
ISSUE O
Y
30
M
M
A3
ROTATED 90 CLOCKWISE
A
A2
A1
DETAIL K
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION b IS MEASURED AT THE MAXIMUM
4. DATUM Z (SEATING PLANE) IS DEFINED BY THE
5. PARALLELISM MEASUREMENT SHALL EXCLUDE
Y14.5M-1994.
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
SPHERICAL CROWNS OF THE SOLDER BALLS.
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
_
DIM
A1
A2
A3
D1
E1
A
b
D
E
e
MIN
0.27
0.35
---
MILLIMETERS
0.32 REF
7.0 BSC
7.0 BSC
0.8 BSC
5.6 BSC
5.6 BSC
(SEATING PLANE)
0.8 REF
NOM
---
---
0.4
NOTE 4
Z
MAX
0.37
0.45
1.5
NOTE 5
0.1 Z
0.1 Z