SPAKDSP303AG100 Freescale Semiconductor, SPAKDSP303AG100 Datasheet - Page 3

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SPAKDSP303AG100

Manufacturer Part Number
SPAKDSP303AG100
Description
IC DSP 24BIT 100MHZ 144-LQFP
Manufacturer
Freescale Semiconductor
Series
DSP563xxr
Type
Fixed Pointr
Datasheets

Specifications of SPAKDSP303AG100

Interface
Host Interface, SSI, SCI
Clock Rate
100MHz
Non-volatile Memory
ROM (576 B)
On-chip Ram
24kB
Voltage - I/o
3.30V
Voltage - Core
3.30V
Operating Temperature
-40°C ~ 100°C
Mounting Type
Surface Mount
Package / Case
144-LQFP
Device Core Size
24b
Clock Freq (max)
100MHz
Mips
100
Device Input Clock Speed
100MHz
Ram Size
24KB
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (min)
3V
Operating Supply Voltage (max)
3.6V
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
144
Package Type
LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SPAKDSP303AG100
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Features
Table 1 lists the features of the DSP56303 device.
Freescale Semiconductor
Internal Peripherals
High-Performance
Power Dissipation
Internal Memories
External Memory
DSP56300 Core
Expansion
Packaging
Feature
• 100 million multiply-accumulates per second (MMACS) with a 100 MHz clock at 3.3 V nominal
• Object code compatible with the DSP56000 core with highly parallel instruction set
• Data arithmetic logic unit (Data ALU) with fully pipelined 24 × 24-bit parallel multiplier-accumulator (MAC),
• Program control unit (PCU) with position-independent code (PIC) support, addressing modes optimized for
• Direct memory access (DMA) with six DMA channels supporting internal and external accesses; one-, two-
• Phase-lock loop (PLL) allows change of low-power divide factor (DF) without loss of lock and output clock
• Hardware debugging support including on-chip emulation (OnCE‘) module, Joint Test Action Group (JTAG)
• Enhanced 8-bit parallel host interface (HI08) supports a variety of buses (for example, ISA) and provides
• Two enhanced synchronous serial interfaces (ESSI), each with one receiver and three transmitters (allows
• Serial communications interface (SCI) with baud rate generator
• Triple timer module
• Up to thirty-four programmable general-purpose input/output (GPIO) pins, depending on which peripherals
• 192 × 24-bit bootstrap ROM
• 8 K × 24-bit RAM total
• Program RAM, instruction cache, X data RAM, and Y data RAM sizes are programmable:
Program RAM
• Data memory expansion to two 256 K × 24-bit word memory spaces using the standard external address
• Program memory expansion to one 256 K × 24-bit words memory space using the standard external
• External memory expansion port
• Chip select logic for glueless interface to static random access memory (SRAMs)
• Internal DRAM Controller for glueless interface to dynamic random access memory (DRAMs)
• Very low-power CMOS design
• Wait and Stop low-power standby modes
• Fully static design specified to operate down to 0 Hz (dc)
• Optimized power management circuitry (instruction-dependent, peripheral-dependent, and mode-
• 144-pin TQFP package in lead-free or lead-bearing versions
• 196-pin molded array plastic-ball grid array (MAP-BGA) package in lead-free or lead-bearing versions
4096 × 24-bit
3072 × 24-bit
2048 × 24-bit
1024 × 24-bit
56-bit parallel barrel shifter (fast shift and normalization; bit stream generation and parsing), conditional
ALU instructions, and 24-bit or 16-bit arithmetic support under software control
DSP applications (including immediate offsets), internal instruction cache controller, internal memory-
expandable hardware stack, nested hardware DO loops, and fast auto-return interrupts
, and three-dimensional transfers (including circular buffering); end-of-block-transfer interrupts; and
triggering from interrupt lines and all peripherals
with skew elimination
test access port (TAP)
glueless connection to a number of industry-standard microcomputers, microprocessors, and DSPs
six-channel home theater)
are enabled
lines
address lines
dependent)
Size
DSP56303 Technical Data, Rev. 11
Table 1. DSP56303 Features
Instruction
Cache Size
1024 × 24-bit
1024 × 24-bit
0
0
X Data RAM
2048 × 24-bit
2048 × 24-bit
3072 × 24-bit
3072 × 24-bit
Size
Description
Y Data RAM
2048 × 24-bit
2048 × 24-bit
3072 × 24-bit
3072 × 24-bit
Size
Instruction
disabled
disabled
enabled
enabled
Cache
Switch Mode
disabled
disabled
enabled
enabled
iii

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