DSPB56720CAG Freescale Semiconductor, DSPB56720CAG Datasheet - Page 50
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DSPB56720CAG
Manufacturer Part Number
DSPB56720CAG
Description
DSP 24BIT AUD 200MHZ 144-LQFP
Manufacturer
Freescale Semiconductor
Series
Symphony™r
Type
Audio Processorr
Datasheet
1.DSPB56721AF.pdf
(54 pages)
Specifications of DSPB56720CAG
Interface
Host Interface, I²C, SAI, SPI
Clock Rate
200MHz
Non-volatile Memory
External
On-chip Ram
744kB
Voltage - I/o
3.30V
Voltage - Core
1.00V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
144-LQFP
Device Core Size
24b
Format
Fixed Point
Clock Freq (max)
200MHz
Mips
200
Device Input Clock Speed
200MHz
Program Memory Size
Not RequiredKB
Operating Supply Voltage (typ)
1/3.3V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
144
Package Type
LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPB56720CAG
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
NOTES
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50
Dimensioning and tolerancing per asme Y14.5M-1994.
Controlling dimension: millimeter
Datum plane H is located at the bottom of lead and is coincident with the lead where the lead exits the plastic body at the
bottom of the parting line.
Datum E, F and D to be determined at datum plane H.
Dimensions to be determined at seating plane C.
Dimensions do not include mold protrusion. Allowable protrusion is 0.25 mm per side. Dimensions include mold mismatch and
are determined at datum plane H.
Dimension does not include dambar protrusion. Dambar protrusion shall not cause the lead width to exceed 0.46 mm.
Minimnum space between protrusion and adjacent lead or protrusion 0.07 mm.
Symphony
Figure 42. 80-Pin Package Outline Drawing (2 of 2)
™
DSP56720/DSP56721 Multi-Core Audio Processors, Rev. 5
Freescale Semiconductor