XC2C512-10FTG256I Xilinx Inc, XC2C512-10FTG256I Datasheet - Page 19

• Manufacturer Part Number: XC2C512-10FTG256I
• Description: IC CR-II CPLD 512MCELL 256-FTBGA
• Manufacturer: Xilinx Inc
• Series: CoolRunner IIr

Specifications of XC2C512-10FTG256I

• Programmable Type: In System Programmable
• Delay Time Tpd(1) Max: 9.2ns
• Voltage Supply - Internal: 1.7 V ~ 1.9 V
• Number Of Logic Elements/blocks: 32
• Number Of Macrocells: 512
• Number Of Gates: 12000
• Number Of I /o: 212
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 256-FTBGA
• Features: Programmable
• Voltage: 1.8V
• Memory Type: CMOS
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of Logic Elements/cells: -

XC2C512 JTAG, Power/Ground, No Connect Pins and Total User I/O
Device Part Marking
DS096 (v3.2) March 8, 2007
Product Specification
TCK
TDI
TDO
TMS
V
voltage)
Power internal (V
Power Bank 1 I/O (V
Power Bank 2 I/O (V
Power Bank 3 I/O (V
Power Bank 4 I/O (V
Ground
No connects
Total user I/O (includes dual
function pins)
CCAUX
(JTAG supply
Pin Type
R
CC
)
CCIO1
CCIO2
CCIO3
CCIO4
Operating Range
)
)
)
)
Device Type
93, 104, 129, 130, 141,
Package
13, 24, 42, 52, 68, 81,
133, 157, 172, 181
156, 177, 190, 207
Speed
92, 105, 132
Figure 5: Sample Package with Part Marking
1, 53, 124
33,59,79
26, 204
PQ208
176
173
98
94
96
11
-
XC2Cxxx
TQ144
7C
www.xilinx.com
J10, K7, K8, K9, K10, L6, L11
H7, H8, H9, H10, J7, J8, J9,
F6, F11, G7, G8, G9, G10,
P3, K13, D12, D5
J11, K11, L9, L10
F7, F8, G6, H6
J6, K6, L7, L8
F9, F10, H11
R
FT256
N12
P12
R11
A10
212
F4
-
This line not
related to device
part number
L13, M10, M11, M12, M13, N10,
D5, D18, E4, E19, J9, J14, K10,
K11, K12, K13, L10, L11, L12,
XC2C512 CoolRunner-II CPLD
N11, N12, N13, P9, P14, V4,
E3, AA3, N20, A20, D4
M14, N14, P12, P13
J12, J13, K14, L14
M9, N9, P10, P11
J10,J11, K9, L9
V19, W5, W18
FG324
AB20
AB19
Y19
C14
270
F1
-
19