EPM1270T144C3N Altera, EPM1270T144C3N Datasheet - Page 9
![IC MAX II CPLD 1270 LE 144-TQFP](/photos/6/70/67061/544-144-tqfp_sml.jpg)
EPM1270T144C3N
Manufacturer Part Number
EPM1270T144C3N
Description
IC MAX II CPLD 1270 LE 144-TQFP
Manufacturer
Altera
Series
MAX® IIr
Specifications of EPM1270T144C3N
Programmable Type
In System Programmable
Delay Time Tpd(1) Max
6.2ns
Voltage Supply - Internal
2.5V, 3.3V
Number Of Logic Elements/blocks
1270
Number Of Macrocells
980
Number Of I /o
116
Operating Temperature
0°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
144-TQFP, 144-VQFP
Voltage
2.5V, 3.3V
Memory Type
FLASH
Number Of Logic Elements/cells
1270
For Use With
544-2380 - KIT DEV MAXII W/EPM 1270N
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Other names
544-1335
EPM1270T144C3N
EPM1270T144C3N
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
EPM1270T144C3N
Manufacturer:
ALTERA
Quantity:
20 000
Introduction
Functional Description
© October 2008 Altera Corporation
MII51002-2.2
This chapter describes the architecture of the MAX II device and contains the
following sections:
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MAX
implement custom logic. Row and column interconnects provide signal interconnects
between the logic array blocks (LABs).
The logic array consists of LABs, with 10 logic elements (LEs) in each LAB. An LE is a
small unit of logic providing efficient implementation of user logic functions. LABs
are grouped into rows and columns across the device. The MultiTrack interconnect
provides fast granular timing delays between LABs. The fast routing between LEs
provides minimum timing delay for added levels of logic versus globally routed
interconnect structures.
The MAX II device I/O pins are fed by I/O elements (IOE) located at the ends of LAB
rows and columns around the periphery of the device. Each IOE contains a
bidirectional I/O buffer with several advanced features. I/O pins support Schmitt
trigger inputs and various single-ended standards, such as 66-MHz, 32-bit PCI, and
LVTTL.
MAX II devices provide a global clock network. The global clock network consists of
four global clock lines that drive throughout the entire device, providing clocks for all
resources within the device. The global clock lines can also be used for control signals
such as clear, preset, or output enable.
“Functional Description” on page 2–1
“Logic Array Blocks” on page 2–4
“Logic Elements” on page 2–6
“MultiTrack Interconnect” on page 2–12
“Global Signals” on page 2–16
“User Flash Memory Block” on page 2–18
“MultiVolt Core” on page 2–22
“I/O Structure” on page 2–23
®
II devices contain a two-dimensional row- and column-based architecture to
2. MAX II Architecture
MAX II Device Handbook