EPM570F256I5 Altera, EPM570F256I5 Datasheet - Page 9

IC MAX II CPLD 570 LE 256-FBGA

EPM570F256I5

Manufacturer Part Number
EPM570F256I5
Description
IC MAX II CPLD 570 LE 256-FBGA
Manufacturer
Altera
Series
MAX® IIr
Datasheets

Specifications of EPM570F256I5

Programmable Type
In System Programmable
Delay Time Tpd(1) Max
5.4ns
Voltage Supply - Internal
2.5V, 3.3V
Number Of Logic Elements/blocks
570
Number Of Macrocells
440
Number Of I /o
160
Operating Temperature
-40°C ~ 100°C
Mounting Type
Surface Mount
Package / Case
256-FBGA
Voltage
2.5V, 3.3V
Memory Type
FLASH
Number Of Logic Elements/cells
570
Family Name
MAX II
# Macrocells
440
Frequency (max)
1.8797GHz
Propagation Delay Time
8.7ns
Number Of Logic Blocks/elements
57
# I/os (max)
160
Operating Supply Voltage (typ)
2.5/3.3V
In System Programmable
Yes
Operating Supply Voltage (min)
2.375V
Operating Supply Voltage (max)
3.6V
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
256
Package Type
FBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / Rohs Status
Not Compliant
Other names
544-1398
EPM570F256I5

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Introduction
Functional Description
© October 2008 Altera Corporation
MII51002-2.2
This chapter describes the architecture of the MAX II device and contains the
following sections:
MAX
implement custom logic. Row and column interconnects provide signal interconnects
between the logic array blocks (LABs).
The logic array consists of LABs, with 10 logic elements (LEs) in each LAB. An LE is a
small unit of logic providing efficient implementation of user logic functions. LABs
are grouped into rows and columns across the device. The MultiTrack interconnect
provides fast granular timing delays between LABs. The fast routing between LEs
provides minimum timing delay for added levels of logic versus globally routed
interconnect structures.
The MAX II device I/O pins are fed by I/O elements (IOE) located at the ends of LAB
rows and columns around the periphery of the device. Each IOE contains a
bidirectional I/O buffer with several advanced features. I/O pins support Schmitt
trigger inputs and various single-ended standards, such as 66-MHz, 32-bit PCI, and
LVTTL.
MAX II devices provide a global clock network. The global clock network consists of
four global clock lines that drive throughout the entire device, providing clocks for all
resources within the device. The global clock lines can also be used for control signals
such as clear, preset, or output enable.
“Functional Description” on page 2–1
“Logic Array Blocks” on page 2–4
“Logic Elements” on page 2–6
“MultiTrack Interconnect” on page 2–12
“Global Signals” on page 2–16
“User Flash Memory Block” on page 2–18
“MultiVolt Core” on page 2–22
“I/O Structure” on page 2–23
®
II devices contain a two-dimensional row- and column-based architecture to
2. MAX II Architecture
MAX II Device Handbook

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