EEEFPC221XAP Panasonic, EEEFPC221XAP Datasheet - Page 17

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EEEFPC221XAP

Manufacturer Part Number
EEEFPC221XAP
Description
CAP 220UF 16V ELECT FP SMD
Manufacturer
Panasonic
Datasheets

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EEEFPC221XAP
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9 . Reflow Soldering Temperature Profile
After the capacitor is subjected to the specified reflow soldering, (see the temperature profile below), it shall
Meet the condition stated in the item 7, No.9.
<Reflow soldering condition>
For φ 4 to φ 6.3, our recommended reflow condition is either of following two conditions.
The temperature shall be measured with thermal couple (type K, φ0.1mm) which shall be placed and
fixed on the top of capacitor body.
* Soldering Method : I.R. or I.R. + heated air.
Two times of reflow
(The 2nd reflow must be done when the capacitor becomes normal condition regarding temperature.)
Maximum Permissible Reflow Soldering Temperature Profile
(B, C, D, D8)
(SiZe code)
(VPS Method is not Available.)
φ4~φ6.3
φ8~φ10
Can Size
(E, F, G)
(1) Peak temperature 260ºC,5s(temp.≧250℃)
(2) Peak temperature 255ºC,10s(temp.≧250℃)
V type FP series
Panasonic Electronic Devices Co., Ltd.
250
200
150
100
50
160 °C
Product Specification
temperature
(255℃)
260℃
245℃
Peak
Time (s)
120 s
(High. temp. Pb free reflow type)
(temp≧250℃)
(temp≧240℃)
Duration
(10 s)
10 s
5 s
(temp≧230℃) (temp≧200℃) frequency
70s
Duration (temp≧200℃)
Duration
Peak temperature
30 s
30 s
30s
Duration
(temp≧230℃)
Duration
70 s
70 s
CE-VFP4-CE-0-3
Reflow
14
2
2

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