ACPM-7868-TR1 Avago Technologies US Inc., ACPM-7868-TR1 Datasheet - Page 12

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ACPM-7868-TR1

Manufacturer Part Number
ACPM-7868-TR1
Description
PA MODULE, LINEAR EDGE, 5X5MM
Manufacturer
Avago Technologies US Inc.
Datasheet

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Handling and Storage
ESD (Electrostatic Discharge)
Electrostatic discharge occurs naturally in the environ-
ment. With the increase in voltage potential, the outlet of
neutralization or discharge will be sought. If the acquired
discharge route is through a semiconductor device,
destructive damage will result.
ESD countermeasure methods should be developed and
used to control potential ESD damage during handling in
a factory environment at each manufacturing site.
MSL (Moisture Sensitivity Level)
Plastic encapsulated surface mount package is sensitive to
damage induced by absorbed moisture and temperature.
Avago Technologies follows JEDEC Standard J-STD 020B.
Each component and package type is classified for
moisture sensitivity by soaking a known dry package at
Moisture Classification Level and Floor Life
Note :
1. The MSL Level is marked on the MSL Label on each shipping bag.
12
MSL Level
1
2
2a
3
4
5
5a
6
Floor Life (out of bag) at factory ambient =< 30°C/60% RH or as stated
Unlimited at =< 30°C/85% RH
1 year
4 weeks
168 hours
72 hours
48 hours
24 hours
Mandatory bake before use. After bake, must be reflowed within the time limit specified on the label
various temperatures and relative humidity, and times.
After soak, the components are subjected to three con-
secutive simulated reflows.
The out of bag exposure time maximum limits are deter-
mined by the classification test describe below which cor-
responds to a MSL classification level 6 to 1 according to
the JEDEC standard IPC/JEDEC J-STD-020B and J-STD-033.
ACPM-7868 is MSL3. Thus, according to the J-STD-033
p.10, the maximum Manufacturers Exposure Time (MET)
for this part is 168 hours. After this time period, the part
would need to be removed from the reel, de-taped and
then re-baked. MSL classification reflow temperature for
the ACPM-7868 is targeted at 260°C +0/-5°C. Figure and
table on next page show typical SMT profile for maximum
temperature of 260 +0/-5°C.

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