MT29F1G08ABADAWP-IT:D Micron Technology Inc, MT29F1G08ABADAWP-IT:D Datasheet - Page 14
MT29F1G08ABADAWP-IT:D
Manufacturer Part Number
MT29F1G08ABADAWP-IT:D
Description
Manufacturer
Micron Technology Inc
Datasheet
1.MT29F1G08ABADAWP-ITD.pdf
(93 pages)
Specifications of MT29F1G08ABADAWP-IT:D
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT29F1G08ABADAWP-IT:D
Manufacturer:
PULSE
Quantity:
15 650
Part Number:
MT29F1G08ABADAWP-IT:D
Manufacturer:
MICRON/美光
Quantity:
20 000
Figure 7: 63-Ball VFBGA (H4) 9mm x 11mm
PDF: 09005aef83e5ffed
m68a.pdf – Rev. D 06/10 EN
Solder ball material:
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-
reflow on Ø0.4 SMD
ball pads.
Seating
plane
63X Ø0.45
0.12 A
8.8 CTR
0.8 TYP
Note:
A
10 9
1. All dimensions are in millimeters.
8
7
7.2 CTR
9 ±0.1
6
0.8 TYP
5
4
3
2
1
0.65 ±0.05
A
B
C
D
E
F
G
H
J
K
L
M
14
11 ±0.1
Ball A1 ID
Bottom side saw fiducials may or
may not be covered with soldermask.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1Gb x8, x16: NAND Flash Memory
0.25 MIN
1.0 MAX
Package Dimensions
© 2010 Micron Technology, Inc. All rights reserved.
Ball A1 ID