BCP53-16T1 ON Semiconductor, BCP53-16T1 Datasheet
BCP53-16T1
Manufacturer Part Number
BCP53-16T1
Description
Manufacturer
ON Semiconductor
Datasheet
1.BCP53-16T1.pdf
(3 pages)
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BCP53 Series
PNP Silicon
Epitaxial Transistors
amplifier applications. The device is housed in the SOT‐223 package
which is designed for medium power surface mount applications.
•
•
•
•
•
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in.
MAXIMUM RATINGS
THERMAL CHARACTERISTICS
© Semiconductor Components Industries, LLC, 2007
August, 2007 - Rev. 5
Collector‐Emitter Voltage
Collector‐Base Voltage
Emitter‐Base Voltage
Collector Current
Total Power Dissipation
Operating and Storage
Thermal Resistance,
Lead Temperature for Soldering,
Time in Solder Bath
This PNP Silicon Epitaxial transistor is designed for use in audio
formed leads absorb thermal stress during soldering, eliminating the
possibility of damage to the die
BCP53T1 = AH
BCP53-10T1 = AH-10
BCP53-16T1 = AH-16
High Current: 1.5 Amps
NPN Complement is BCP56
The SOT‐223 Package can be soldered using wave or reflow. The
Device Marking:
Pb-Free Packages are Available
x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in.
@ T
Derate above 25°C
Temperature Range
Junction to Ambient
(surface mounted)
0.0625″ from case
A
= 25°C (Note 1.)
Characteristic
Rating
(T
C
= 25°C unless otherwise noted)
Symbol
Symbol
T
V
V
V
R
J
P
, T
CEO
CBO
EBO
T
I
θJA
C
D
L
stg
-65 to
Value
+150
-100
-5.0
Max
83.3
-80
260
1.5
1.5
12
10
1
mW/°C
Watts
°C/W
Unit
Unit
Vdc
Vdc
Vdc
Adc
Sec
°C
°C
†For information on tape and reel specifications,
BCP53T1
BCP53T1G
BCP53-10T1
BCP53-10T1G
BCP53-16T1
BCP53-16T1G
BCP53-16T3
BCP53-16T3G
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
CURRENT SURFACE MOUNT
Device
1
CASE 318E
SOT-223
STYLE 1
MEDIUM POWER HIGH
2
(Note: Microdot may be in either location)
PNP TRANSISTORS
3
ORDERING INFORMATION
BASE
1
http://onsemi.com
4
(Pb-Free)
(Pb-Free)
(Pb-Free)
(Pb-Free)
Package
SOT-223
SOT-223
SOT-223
SOT-223
SOT-223
SOT-223
SOT-223
SOT-223
COLLECTOR 2,4
AHxxx
xxx
A
Y
W
G
EMITTER 3
Publication Order Number:
MARKING DIAGRAM
1
= Device Code
= -10 or -16
= Assembly Location
= Year
= Work Week
= Pb-Free Package
1000/Tape & Reel
1000/Tape & Reel
1000/Tape & Reel
1000/Tape & Reel
1000/Tape & Reel
1000/Tape & Reel
4000/Tape & Reel
4000/Tape & Reel
AHxxxG
AYW
Shipping
G
BCP53T1/D
†
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BCP53-16T1 Summary of contents
Page 1
... The SOT‐223 Package can be soldered using wave or reflow. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die • Device Marking: BCP53T1 = AH BCP53-10T1 = AH-10 BCP53-16T1 = AH-16 • Pb-Free Packages are Available MAXIMUM RATINGS (T = 25°C unless otherwise noted) C Rating Collector‐ ...
Page 2
... COLLECTOR CURRENT (mA) C Figure 1. DC Current Gain 1 0 (BE)sat (BE)on 0.6 0.4 0 (CE)sat COLLECTOR CURRENT (mA) C Figure 3. Saturation and “ON” Voltages BCP53 Series (T = 25°C unless otherwise noted) A Symbol = (BR)CBO = -1.0 mAdc (BR)CEO = -100 μAdc 1.0 kohm (BR)CER = (BR)EBO = CBO = EBO ...
Page 3
... PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com BCP53 Series PACKAGE DIMENSIONS SOT-223 CASE 318E-04 ISSUE K NOTES: 1. Y14.5M, 1982. ...