CC109112397 Lineage Power, CC109112397 Datasheet - Page 20

• Manufacturer Part Number: CC109112397
• Description: Module DC-DC 1-OUT 0.8V to 2V 30A 8-Pin SMT T/R
• Manufacturer: Lineage Power
• Type: Step Downr

Specifications of CC109112397

• Package: 8SMT
• Output Current: 30 A
• Output Voltage: 0.8 to 2 V
• Input Voltage: 3.3 V
• Number Of Outputs: 1

Data Sheet
October 21, 2009
Surface Mount Information
Pick and Place
The Austin MegaLynx
frame construction and are designed for a fully
automated assembly process. The modules are fitted
with a label designed to provide a large surface area
for pick and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300
product information such as product code, serial
number and location of manufacture.
Figure 36. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and pick &
placement speed should be considered to optimize
this process. The minimum recommended inside
nozzle diameter for reliable operation is 3mm. The
maximum nozzle outer diameter, which will safely fit
within the allowable component spacing, is 5 mm
max.
Tin Lead Soldering
The ATM030 modules are lead free modules and can
be soldered either in a lead-free solder process or in a
conventional Tin/Lead (Sn/Pb) process. It is
recommended that the customer review data sheets
in order to customize the solder reflow profile for each
application board assembly. The following
instructions must be observed when soldering these
units. Failure to observe these instructions may result
in the failure of or cause damage to the modules, and
can adversely affect long-term reliability.
LINEAGE
POWER
TM
SMT modules use an open
o
C. The label also carries
Austin MegaLynx
2.7 – 4.0Vdc input; 0.8 to 2.0Vdc Output; 30A output current
TM
SMT: Non-Isolated DC-DC Power Modules:
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
Figure 37. Reflow Profile for Tin/Lead (Sn/Pb)
process.
Figure 38. Time Limit Curve Above 205
for Tin Lead (Sn/Pb) process.
o
300
200
250
240
235
230
225
220
205
200
100
215
210
C. Typically, the eutectic solder melts at 183
150
50
0
0
10
Heat zo ne
max 4
P reheat zo ne
max 4
P eak Temp 235
20
REFLOW TIME (S)
o
Cs
o
So ak zo ne
30-240s
Cs
-1
-1
30
o
C
40
T
205
lim
o
above
C
o
Co o ling
zo ne
1 -4
C Reflow
50
o
Cs
-1
o
20
60
C,