MT46V32M16P-5B IT:F Micron Technology Inc, MT46V32M16P-5B IT:F Datasheet - Page 14

• Manufacturer Part Number: MT46V32M16P-5B IT:F
• Description: DRAM Chip DDR SDRAM 512M-Bit 32Mx16 2.6V 66-Pin TSOP Tray
• Manufacturer: Micron Technology Inc
• Type: DDR SDRAMr

Specifications of MT46V32M16P-5B IT:F

• Package: 66TSOP
• Density: 512 Mb
• Address Bus Width: 15 Bit
• Operating Supply Voltage: 2.6 V
• Maximum Clock Rate: 400 MHz
• Maximum Random Access Time: 0.7 ns
• Operating Temperature: -40 to 85 °C
• Organization: 32Mx16
• Address Bus: 15b
• Access Time (max): 700ps
• Operating Supply Voltage (typ): 2.6V
• Package Type: TSOP
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 2.7V
• Operating Supply Voltage (min): 2.5V
• Supply Current: 215mA
• Pin Count: 66
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Compliant

Figure 9:
PDF: 09005aef80a1d9d4/Source: 09005aef82a95a3a
512Mb_DDR_x4x8x16_D2.fm - 512Mb DDR: Rev. N; Core DDR Rev. B 2/09 EN
CONDITION. THE PRE-REFLOW
SEATING PLANE
REFERS TO POST REFLOW
SOLDER BALL DIAMETER
DIAMETER IS Ø 0.40.
0.10 C
11.00
60-Ball FBGA (10mm x 12.5mm)
60X Ø
5.50 ±0.05
BALL A9
Notes:
.45
0.85 ±0.05
C
1. All dimensions are in millimeters.
2. Topside part marking decoder can be found on Micron’s Web site.
3.20 ±0.05
0.80 (TYP)
10.00 ±0.10
6.40
1.80
CTR
C L
5.00 ±0.05
C L
BALL A1
BALL A1 ID
1.00
TYP
6.25 ±0.05
12.50 ±0.10
14
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.20 MAX
512Mb: x4, x8, x16 DDR SDRAM
SOLDER BALL MATERIAL:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3% Ag, 0.5% Cu
SOLDER BALL PAD: Ø .33
NON SOLDER MASK DEFINED
SUBSTRATE: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
BALL #1 ID
Package Dimensions
©2000 Micron Technology, Inc. All rights reserved.