BLM41PG181SN1L Murata Electronics, BLM41PG181SN1L Datasheet - Page 146
![no-image](/images/manufacturer_photos/0/4/465/murata_electronics_sml.jpg)
BLM41PG181SN1L
Manufacturer Part Number
BLM41PG181SN1L
Description
EMI Filter 3A Flat Style SMD
Manufacturer
Murata Electronics
Type
EMI Suppression Filterr
Datasheet
1.BLM18EG121SN1-D.pdf
(209 pages)
Specifications of BLM41PG181SN1L
Case Size
1806
Maximum Current Rating
3 A
Termination
Flat Style
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BLM41PG181SN1L
Manufacturer:
MURATA
Quantity:
5 000
Part Number:
BLM41PG181SN1L
Manufacturer:
MURATA/村田
Quantity:
20 000
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(3) Reworking with Solder Iron
(1) Cleaning Temperature: 60 C max. (40 C max. for
(2) Ultrasonic
(3) Cleaning Agent
!Note
144
4. Cleaning
The following conditions must be strictly followed when
using a soldering iron.
Pre-heating: 150 C 60s min.*
Soldering iron power output / Tip diameter:
Temperature of soldering iron tip / Soldering time / Times:
Following conditions should be observed when cleaning
chip EMI filter.
alcohol type cleaner)
Output: 20W/liter max.
Duration: 5 minutes max.
Frequency: 28 to 40kHz
The following list of cleaning agents have been tested on
the individual components. Evaluation of final assembly
should be completed prior to production.
*
*
1
2
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
30W max. / ø3mm max.
350 C max. / 3-4s / 2 times*
NFM55P: 100 C/60s+200 C/60s
NFE31PT152Z1E9: 280 C max. / 10s max. / 2 times
1
2
(4) Ensure that flux residue is completely removed.
Do not allow the tip of the soldering iron to directly
contact the chip.
For additional methods of reworking with a soldering iron,
please contact Murata engineering.
(a) Alcohol cleaning agent
(b) Aqueous cleaning agent
Component should be thoroughly dried after aqueous
agent has been removed with deionized water.
Isopropyl alcohol (IPA)
Pine Alpha ST-100S
NFp Chip EMIFILr
Soldering and Mounting
Mar.28,2011
C31E.pdf
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