TD62064AP(5,J,S) Toshiba, TD62064AP(5,J,S) Datasheet - Page 10
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TD62064AP(5,J,S)
Manufacturer Part Number
TD62064AP(5,J,S)
Description
Manufacturer
Toshiba
Datasheet
1.TD62064AP5JS.pdf
(11 pages)
Specifications of TD62064AP(5,J,S)
Polarity
NPN
Number Of Elements
4
Collector-emitter Voltage
50V
Collector Current (dc) (max)
1.5A
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Through Hole
Pin Count
16
Package Type
PDIP
Lead Free Status / Rohs Status
Not Compliant
About solderability, following conditions were confirmed
• Solderability
Points to Remember on Handling of ICs
(1) Use of Sn-37Pb solder Bath
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
(1)
(2)
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device
so that heat is appropriately radiated, not to exceed the specified junction temperature (T
and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation
design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition,
please design the device taking into considerate the effect of IC heat radiation with peripheral
components.
Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the
motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply
is small, the device’s motor power supply and output pins might be exposed to conditions beyond
maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system
design.
10
TD62064APG/AFG
2011-01-14
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