TCPT1200X01 Vishay, TCPT1200X01 Datasheet - Page 5

• Manufacturer Part Number: TCPT1200X01
• Manufacturer: Vishay
• Type: Transmissiver

Specifications of TCPT1200X01

• Number Of Elements: 1
• Output Device: Phototransistor
• Gap Width: 2mm
• Slit Width: 0.3mm
• Reverse Breakdown Voltage: 5V
• Collector-emitter Voltage: 70V
• Forward Current: 25mA
• Collector Current (dc) (max): 20mA
• Power Dissipation: 150mW
• Fall Time: 150000ns
• Rise Time: 150000ns
• Pin Count: 4
• Mounting: Surface Mount
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Compliant

Reflow Solder Profiles
Drypack
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a des-
iccant.
Floor Life
Floor life (time between soldering and removing from
MBB) must not exceed the time indicated in
J-STD-020. Acc. JEDEC, J-STD-020, TCPT1200X01
is released to Moisture Sensitivity Level 2, for use of
Lead Tin (SnPb) Reflow Solder Profile (figure 11) or
Level 3, for use of Lead-free (Sn) Reflow Solder Pro-
Document Number 83754
Rev. 1.4, 11-Feb-05
VISHAY
280
260
240
220
200
180
160
140
120
100
280
260
240
220
200
180
160
140
120
100
80
80
Figure 14. Lead Tin (SnPb) Reflow Solder Profile
Figure 13. Lead-Free (Sn) Reflow Solder Profile
4 C/s MAX
4 C/s MAX
°
°
Pre-heating time:
Pre-heating time:
90
90
150 C
150 C
180 C
180 C
±
±
°
°
4 C/s MAX
°
°
30 s
30 s
4 C/s MAX
°
240 C
Time ( s )
Time ( s )
°
260 C
°
°
230 C
230 C
°
°
Heating time:
Heating time:
30 10 s
10 - 20 s
±
19152
19153
file (figure 10)
Floor Life: 12 month (level 2) or 168 hours (level 3)
Floor Conditions: T
Drying
In case of moisture absorption devices should be
baked before soldering. Conditions see J-STD-020 or
Label. Devices taped on reel dry using recommended
conditions 192 h @ 40 °C (± 5 °C), RH < 5 %
or 96 h @ 60 °C (± 5 °C), RH < 5 %
amb
Vishay Semiconductors
TCPT1200X01
< 30 °C, RH < 60 %
www.vishay.com
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