MT16JSF25664HZ-1G1F1 Micron Technology Inc, MT16JSF25664HZ-1G1F1 Datasheet
MT16JSF25664HZ-1G1F1
Specifications of MT16JSF25664HZ-1G1F1
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MT16JSF25664HZ-1G1F1 Summary of contents
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... For component data sheets, refer to Micron’s Web site: Features • DDR3 functionality and operations supported as defined in the component data sheet • 204-pin, small-outline dual in-line memory module (SODIMM) • Fast data transfer rates: PC3-10600, PC3-8500, or PC3-6400 • 2GB (256 Meg x 64) • ...
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... The data sheet for the base device can be found on Micron’s Web site. 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Consult factory for current revision codes. Example: MT16JSF25664HZ-1G1D1. PDF: 09005aef83364b70/Source: 09005aef83364bd3 JSF16C256x64HZ.fm - Rev. A 5/08 EN ...
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Pin Assignments and Descriptions Table 4: Pin Assignments 204-Pin DDR3 SODIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol DQ19 105 REF 107 ...
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... Input with write data. Center-aligned with write data. SDA I/O Serial data: SDA is a bidirectional pin used to transfer addresses and data into and out of the temperature sensor/SPD EEPROM on the module on the I EVENT# Output Temperature event: The EVENT# pin is asserted by the temperature sensor when critical (open drain) temperature thresholds have been exceeded ...
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... V Supply Termination voltage: Used for control, command, and address ( – No connect: These pins are not connected on the module. PDF: 09005aef83364b70/Source: 09005aef83364bd3 JSF16C256x64HZ.fm - Rev. A 5/08 EN 2GB (x64, DR) 204-Pin Halogen-Free DDR3 SDRAM SODIMM /2). DD Micron Technology, Inc., reserves the right to change products or specifications without notice. ...
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Functional Block Diagram Figure 2: Functional Block Diagram S1# S0# DQS0# DQS0 DM0 DM DQ0 DQ DQ1 DQ DQ2 DQ DQ3 DQ DQ4 DQ DQ5 DQ DQ6 DQ DQ7 DQS1# DQS1 DM1 DM DQ8 DQ DQ9 ...
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... DRAM is connected to a single trace and terminated (rather than a tree structure, where the termination is off the module near the connector). Inherent to fly-by topology, the timing skew between the clock and DQS signals can be easily accounted for by using the write leveling feature of DDR3 ...
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... Electrical Specifications Stresses greater than those listed in Table 6 may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other conditions outside those indicated in each device’s data sheet is not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability ...
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... Micron encourages designers to simulate the signal characteristics of the system’s memory bus to ensure adequate signal integrity of the entire memory system. Power Operating voltages are specified at the DRAM, not at the edge connector of the module. Designers must account for any system voltage drops at anticipated power levels to ensure the required supply voltage is maintained. ...
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... Refresh current Self refresh temperature current: MAX T Self refresh temperature current (SRT-enabled): MAX T All banks interleaved read current Notes: 1. One module rank in the active I 2. All ranks in this I PDF: 09005aef83364b70/Source: 09005aef83364bd3 JSF16C256x64HZ.fm - Rev. A 5/08 EN 2GB (x64, DR) 204-Pin Halogen-Free DDR3 SDRAM SODIMM = 85° ...
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... Temperature Sensor with Serial Presence-Detect EEPROM The temperature sensor continuously monitors the module’s temperature and can be read back at any time over the I Table 10: Temperature Sensor with Serial Presence-Detect EEPROM Operating Conditions Parameter/Condition Supply voltage Supply current 3.3V DD Input high voltage: Logic 1; SCL, SDA Input low voltage: Logic 0 ...
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The interrupt mode enables software to reset EVENT# after a critical temperature threshold has been detected. Threshold points are set in the configuration register by the user. This mode triggers the critical temperature limit and both the MIN and MAX ...
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Table 12: Temperature Sensor Registers Name Pointer register Capability register Configuration register Alarm temperature upper boundary register Alarm temperature lower boundary register Critical temperature register Temperature register Pointer Register The pointer register selects which of the 16-bit registers is being ...
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Capability Register The capability register indicates the features and functionality supported by the temper- ature sensor. This register is a read-only register. Table 15: Capability Register (Address: 0x00 RFU RFU 7 6 RFU RFU Table 16: Capability Register ...
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Table 18: Configuration Register Bit Descriptions Bit Description 0 Event mode 0: Comparator mode 1: Interrupt mode 1 EVENT# polarity 0: Active LOW 1: Active HIGH 2 Critical event only 0: EVENT# trips on alarm or critical temperature event 1: ...
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Figure 4: Hysteresis Below window bit Above window bit Notes the value set in the alarm temperature lower boundary trip register Hyst is the value set in the hysteresis bits of the ...
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Temperature Format The temperature trip point registers and temperature readout register use a “2’s complement” format to enable negative numbers. The least significant bit (LSB) is equal to 0.0625°C or 0.25°C depending on which register is referenced example, ...
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Temperature Register The temperature register is a read-only register that provides the current temperature detected by the temperature sensor. The LSB for this register is 0.0625°C with a resolu- tion of 0.0625°C. The most significant bit (MSB) is 128°C in ...
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... U19 3.0 (0.12) TYP 39.0 (1.535) 21.0 (0.827) TYP TYP 24.8 (0.976) tive owners. Micron Technology, Inc., reserves the right to change products or specifications without notice. 19 Module Dimensions U6 30.15 (1.187) 29.85 (1.175) U10 20.0 (0.787) TYP Pin 203 U16 U20 4.0 (0.157) ...