MT47H128M8CF-25:H Micron Technology Inc, MT47H128M8CF-25:H Datasheet - Page 4

• Manufacturer Part Number: MT47H128M8CF-25:H
• Description: IC DDR2 SDRAM 1GBIT 60FBGA
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr
• Series: -r

Specifications of MT47H128M8CF-25:H

• Organization: 128Mx8
• Density: 1Gb
• Address Bus: 17b
• Access Time (max): 400ps
• Maximum Clock Rate: 800MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: 0C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 125mA
• Pin Count: 60
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Format - Memory: RAM
• Memory Type: DDR2 SDRAM
• Memory Size: 1G (128M x 8)
• Speed: 2.5ns
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.9 V
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 60-TFBGA
• Lead Free Status / Rohs Status: Compliant

Contents
State Diagram .................................................................................................................................................. 9
Functional Description ................................................................................................................................... 10
Functional Block Diagrams ............................................................................................................................. 12
Ball Assignments and Descriptions ................................................................................................................. 15
Packaging ...................................................................................................................................................... 19
Electrical Specifications – Absolute Ratings ..................................................................................................... 23
Electrical Specifications – I
AC Timing Operating Specifications ................................................................................................................ 34
AC and DC Operating Conditions .................................................................................................................... 44
ODT DC Electrical Characteristics ................................................................................................................... 45
Input Electrical Characteristics and Operating Conditions ............................................................................... 46
Output Electrical Characteristics and Operating Conditions ............................................................................. 49
Output Driver Characteristics ......................................................................................................................... 51
Power and Ground Clamp Characteristics ....................................................................................................... 55
AC Overshoot/Undershoot Specification ......................................................................................................... 56
Input Slew Rate Derating ................................................................................................................................ 58
Commands .................................................................................................................................................... 71
Mode Register (MR) ........................................................................................................................................ 77
Extended Mode Register (EMR) ....................................................................................................................... 82
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
Industrial Temperature .............................................................................................................................. 10
Automotive Temperature ........................................................................................................................... 11
General Notes ............................................................................................................................................ 11
Package Dimensions .................................................................................................................................. 19
FBGA Package Capacitance ......................................................................................................................... 22
Temperature and Thermal Impedance ........................................................................................................ 23
I
I
Truth Tables ............................................................................................................................................... 71
DESELECT ................................................................................................................................................. 75
NO OPERATION (NOP) .............................................................................................................................. 76
LOAD MODE (LM) ..................................................................................................................................... 76
ACTIVATE .................................................................................................................................................. 76
READ ......................................................................................................................................................... 76
WRITE ....................................................................................................................................................... 76
PRECHARGE .............................................................................................................................................. 77
REFRESH ................................................................................................................................................... 77
SELF REFRESH ........................................................................................................................................... 77
Burst Length .............................................................................................................................................. 78
Burst Type ................................................................................................................................................. 79
Operating Mode ......................................................................................................................................... 79
DLL RESET ................................................................................................................................................. 79
Write Recovery ........................................................................................................................................... 80
Power-Down Mode .................................................................................................................................... 80
CAS Latency (CL) ........................................................................................................................................ 81
DLL Enable/Disable ................................................................................................................................... 83
Output Drive Strength ................................................................................................................................ 83
DQS# Enable/Disable ................................................................................................................................. 83
RDQS Enable/Disable ................................................................................................................................. 83
Output Enable/Disable ............................................................................................................................... 83
On-Die Termination (ODT) ........................................................................................................................ 84
DD
DD7
Specifications and Conditions ............................................................................................................... 26
Conditions .......................................................................................................................................... 27
DD
Parameters ........................................................................................................ 26
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1Gb: x4, x8, x16 DDR2 SDRAM
© 2004 Micron Technology, Inc. All rights reserved.