MT48H8M32LFB5-8 IT:G TR Micron Technology Inc, MT48H8M32LFB5-8 IT:G TR Datasheet - Page 22
MT48H8M32LFB5-8 IT:G TR
Manufacturer Part Number
MT48H8M32LFB5-8 IT:G TR
Description
Manufacturer
Micron Technology Inc
Type
Mobile SDRAMr
Datasheet
1.MT48H8M32LFB5-8_ITG_TR.pdf
(86 pages)
Specifications of MT48H8M32LFB5-8 IT:G TR
Organization
8Mx32
Density
256Mb
Address Bus
14b
Access Time (max)
9/7ns
Maximum Clock Rate
125MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
115mA
Pin Count
90
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Compliant
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256mb_mobile_sdram_y36n.pdf - Rev. I 11/09 EN
10. For auto precharge mode, the precharge timing budget (
11. CLK must be toggled a minimum of two times during this period.
12. Required clocks are specified by JEDEC functionality and are not dependent on any tim-
13. Timing is specified by
14. Timing is specified by
15. Timing is specified by
16. Based on
ns reduction in slew rate. Input hold times remain unchanged. If the slew rate exceeds
4.5V/ns, functionality is uncertain.
after the first clock delay and after the last WRITE is executed.
ing parameter.
cycle rate.
t
CK (MIN), CL = 3.
Electrical Specifications – AC Operating Conditions
256Mb: 16 Meg x 16, 8 Meg x 32 Mobile SDRAM
t
t
t
CKS. Clock(s) specified as a reference only at minimum cycle rate.
WR plus
WR.
22
t
RP. Clock(s) specified as a reference only at minimum
Micron Technology, Inc. reserves the right to change products or specifications without notice.
t
RP) begins at
©2008 Micron Technology, Inc. All rights reserved.
t
RP – (1 ×
t
CKns),
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