LU82551ER 860613 Intel, LU82551ER 860613 Datasheet - Page 97

• Manufacturer Part Number: LU82551ER 860613
• Manufacturer: Intel

Specifications of LU82551ER 860613

• Lead Free Status / Rohs Status: Supplier Unconfirmed

12.0
12.1
Datasheet
Figure 28. Dimension Diagram for the 196-pin BGA
Note: No changes to existing soldering processes are needed for the 0.32 mm substrate change.
Package and Pinout Information
Package Information
The 82551ER is a 196-pin Ball Grid Array (BGA) package. Package dimensions are shown in
Figure
Handbook.
28. More information on Intel
0.32 +/-0.04
Substrate change from
0.36 mm to 0.32 mm
1.56 +/-0.19
0.40 +/-0.10
0.85
®
device packaging is available in the Intel Packaging
Note: All dimensions are in millimeters.
Seating Plate
Networking Silicon — 82551ER
30
o
89