LMC555CBP/NOPB National Semiconductor, LMC555CBP/NOPB Datasheet - Page 10

• Manufacturer Part Number: LMC555CBP/NOPB
• Manufacturer: National Semiconductor
• Type: Standardr

Specifications of LMC555CBP/NOPB

• # Internal Timers: 1
• Power Dissipation: 568mW
• Propagation Delay Time: 100ns
• Operating Supply Voltage (typ): 1.5V
• Package Type: uSMD
• High Level Output Current: -10mA
• Low Level Output Current: 50mA
• Pin Count: 8
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Lead Free Status / Rohs Status: Compliant

NOTES: UNLESS OTHERWISE SPECIFIED
1. EPOXY COATING
2. FOR SOLDER BUMP COMPOSITION, SEE “SOLDER INFORMATION” IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB PAGE
(www.national.com).
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACK-
AGE HEIGHT.
6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC.
8-Bump micro SMD Package
NS Package Number TPA08FGA
X
= 1.412 X
= 1.438 X
= 0.500
1
2
3
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