K4H511638D-ULB3000 Samsung Semiconductor, K4H511638D-ULB3000 Datasheet - Page 21

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K4H511638D-ULB3000

Manufacturer Part Number
K4H511638D-ULB3000
Description
Manufacturer
Samsung Semiconductor
Type
DDR SDRAMr
Datasheet

Specifications of K4H511638D-ULB3000

Organization
32Mx16
Density
512Mb
Address Bus
13b
Access Time (max)
700ps
Maximum Clock Rate
333MHz
Operating Supply Voltage (typ)
2.5V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
2.7V
Operating Supply Voltage (min)
2.3V
Supply Current
150mA
Pin Count
66
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant
DDR SDRAM Output Driver V-I Characteristics
DDR SDRAM Output driver characteristics are defined for full and half strength operation as selected by the EMRS bit A1.
Figures 3 and 4 show the driver characteristics graphically, and tables 8 and 9 show the same data in tabular format suitable for input
into simulation tools. The driver characteristcs evaluation conditions are:
Output Driver Characteristic Curves Notes:
1. The full variation in driver current from minimum to maximum process, temperature and voltage will lie within the outer bounding lines
2. It is recommended that the "typical" IBIS V-I curve lie within the inner bounding lines of the V-I curves of Figure 3 and 4.
3. The full variation in the ratio of the "typical" IBIS pullup to "typical" IBIS pulldown current should be unity
K4H510438D
K4H510838D
K4H511638D
23.0 IBIS : I/V Characteristics for Input and Output Buffers
the of the V-I curve of Figure 3 and 4.
source voltages from 0.1 to1.0. This specification is a design objective only. It is not guaranteed.
Figure 3. I/V characteristics for input/output buffers:Pull up(above) and pull down(below)
Typical
Minimum
Maximum
- 1 0 0
- 1 2 0
- 1 4 0
- 1 6 0
- 1 8 0
- 2 0 0
- 2 2 0
160
140
120
100
- 2 0
- 4 0
- 6 0
- 8 0
80
60
40
20
0
0
0.0
0 .0
Pulldown Characteristics for Full Strength Output Driver
Pullup Characteristics for Full Strength Output Driver
25×C
70×C
0×C
0.5
Vdd/Vddq = 2.5V, typical process
Vdd/Vddq = 2.3V, slow-slow process
Vdd/Vddq = 2.7V, fast-fast process
1.0
1 .0
1.5
2.0
2 .0
2.5
Rev. 1.2 January 2006
Vout(V)
Vout(V)
+/-
Typical High
Minumum
Typical Low
Maximum
DDR SDRAM
Typical Low
Typical High
Maximum
Minimum
10%, for device drain to

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