HSMP386BTR1 Avago Technologies US Inc., HSMP386BTR1 Datasheet

HSMP386BTR1

Manufacturer Part Number
HSMP386BTR1
Description
Manufacturer
Avago Technologies US Inc.
Type
Attenuator/Switchr
Datasheet

Specifications of HSMP386BTR1

Configuration
Single
Forward Current
1000mA
Operating Temperature Classification
Military
Reverse Voltage
50V
Mounting
Surface Mount
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
3
Lead Free Status / Rohs Status
Not Compliant
HSMP-386x
Surface Mount PIN Diodes
Data Sheet
Description/Applications
The HSMP-386x series of general purpose PIN diodes are
designed for two classes of applications. The first is attenu-
ators where current consumption is the most important
design consideration. The second application for this
series of diodes is in switches where low capacitance is the
driving issue for the designer.
The HSMP-386x series Total Capacitance (C
sistance (R
require guaranteed performance, the general purpose HSMP-
383x series is recommended.
A SPICE model is not available for PIN diodes as SPICE
does not provide for a key PIN diode characteristic, carrier
lifetime.
Pin Connections and Package Marking, SOT-363
Notes:
1. Package marking provides orientation, identification, and date code.
2. See “Electrical Specifications” for appropriate package marking.
1
2
3
T
) are typical specifications. For applications that
6
5
4
T
) and Total Re-
Features
• Unique Configurations in Surface Mount Packages
– Add Flexibility
– Save Board Space
– Reduce Cost
• Switching
– Low Distortion Switching
– Low Capacitance
• Attenuating
– Low Current Attenuating for Less Power
• Matched Diodes for Consistent Performance
• Better Thermal Conductivity for Higher Power
• Low Failure in Time (FIT) Rate
• Lead-free
Note:
1. For more information see the Surface Mount PIN Reliability Data
Sheet.
Dissipation
Consumption
[1]

Related parts for HSMP386BTR1

HSMP386BTR1 Summary of contents

Page 1

HSMP-386x Surface Mount PIN Diodes Data Sheet Description/Applications The HSMP-386x series of general purpose PIN diodes are designed for two classes of applications. The first is attenu- ators where current consumption is the most important design consideration. The second application for this series of diodes is in switches where low capacitance is the driving issue for the designer. The HSMP-386x series Total Capacitance (C sistance (R ) are typical specifications. For applications that T require guaranteed performance, the general purpose HSMP- 383x series is recommended. A SPICE model ...

Page 2

Package Lead Code Identification, SOT-23, SOT-143 (Top View) SERIES SINGLE #0 #2 COMMON COMMON ANODE CATHODE #3 #4 RING QUAD UNDER DEVELOPMENT Absolute Maximum Ratings T = +25°C [1] C Symbol Parameter I Forward Current (1 µs Pulse Peak Inverse Voltage IV T Junction Temperature j T Storage Temperature ...

Page 3

HSMP-386x Typical Parameters at T Part Number Total Resistance HSMP- R (Ω) T 386x 22 T est Conditions f = 100 MHz Typical Performance 25°C, each diode C 0.35 0.30 1 MHz 0.25 100 MHz 0.20 1 GHz 0. ...

Page 4

Typical Applications for Multiple Diode Products RF COMMON RF 1 BIAS 1 Figure 6. Simple SPDT Switch, Using Only Positive Current. RF COMMON RF 1 Figure 8. Switch Using Both Positive and Negative Current. VARIABLE BIAS INPUT FIXED BIAS VOLTAGE Figure 10. Four Diode p Attenuator. See AN1048 for details. Figure 10. Four Diode π Attenuator. See AN1048 for details BIAS 2 BIAS Figure 7. High Isolation SPDT Switch, Dual Bias. BIAS ...

Page 5

Typical Applications for Multiple Diode Products BIAS Figure 11. High Isolation SPST Switch Figure 11. High Isolation SPST Switch (Repeat Cells as Required). (Repeat Cells as Required Figure 13. HSMP-386L used in a SP3T Switch. 5 (continued Figure 12. HSMP-386L Unconnected Trio used in a Positive Voltage, High Isolation Switch Figure 14. HSMP-386L Unconnected Trio used in a Dual Voltage, High Isolation Switch. ...

Page 6

Ordering Information Specify part number followed by option. For example: HSMP - 386x - XXX Option Descriptions -BLKG = Bulk, 100 pcs. per antistatic bag -TR1G = Tape and Reel, 3000 devices per 7" reel -TR2G = Tape and Reel, 10,000 devices per 13" reel Tape and Reeling conforms to Electronic Industries RS-481, “Taping of Surface Mounted Components for Automated Placement. ” Assembly Information SOT-323 PCB Footprint Recommended PCB pad layouts for the miniature SOT packages are shown in Figures 15, 16, 17. These layouts provide ample allowance for package placement by ...

Page 7

SMT Assembly Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity ...

Page 8

Package Dimensions Outline 23 (SOT-23 XXX SYMBOL Notes: e2 XXX-package marking E Drawings are not to scale L Outline 363 (SC-70, 6 Lead SYMBOL E D ...

Page 9

Device Orientation REEL CARRIER TAPE USER FEED DIRECTION COVER TAPE For Outlines SOT-23, -323 TOP VIEW ABC ABC ABC ABC Note: "AB" represents package marking code. "C" represents date code. Tape Dimensions and Product Orientation For Outline SOT- MAX ...

Page 10

Tape Dimensions and Product Orientation For Outlines SOT-323, -363 DESCRIPTION SYMBOL CAVITY LENGTH A 0 WIDTH B 0 DEPTH K 0 PITCH P BOTTOM HOLE DIAMETER D 1 PERFORATION DIAMETER D PITCH P 0 POSITION E CARRIER TAPE WIDTH ...

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