5962-9176401MXA Analog Devices Inc, 5962-9176401MXA Datasheet - Page 4

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5962-9176401MXA

Manufacturer Part Number
5962-9176401MXA
Description
Manufacturer
Analog Devices Inc
Datasheet

Specifications of 5962-9176401MXA

Number Of Channels
4
Resolution
12b
Conversion Rate
167KSPS
Interface Type
Parallel
Single Supply Voltage (typ)
5V
Dual Supply Voltage (typ)
±5/±15V
Settling Time
10us
Architecture
R-2R
Power Supply Requirement
Single/Dual
Output Type
Voltage
Single Supply Voltage (min)
4.75V
Single Supply Voltage (max)
5.25V
Dual Supply Voltage (min)
±4.75V
Dual Supply Voltage (max)
±15.75V
Operating Temp Range
-55C to 125C
Operating Temperature Classification
Military
Mounting
Through Hole
Pin Count
28
Lead Free Status / Rohs Status
Not Compliant
DAC8412/DAC8413
WAFER TEST LIMITS
Parameter
Integral Nonlinearity
Differential Nonlinearity
Min Scale Offset
Full-Scale Offset
Logic Input High Voltage
Logic Input Low Voltage
Logic Input Current
Logic Output High Voltage
Logic Output Low Voltage
Positive Supply Current
Negative Supply Current
NOTE
Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.
ABSOLUTE MAXIMUM RATINGS
(
V
V
V
V
V
V
Current into Any Pin 4 . . . . . . . . . . . . . . . . . . . . . . .
Digital Input Voltage to DGND . . . . . –0.3 V, V
Digital Output Voltage to DGND . . . . . . . . . . –0.3 V, +7.0 V
Operating Temperature Range
Dice Junction Temperature . . . . . . . . . . . . . . . . . . . . . +150 C
Storage Temperature . . . . . . . . . . . . . . . . . . –65 C to +150 C
Power Dissipation Package . . . . . . . . . . . . . . . . . . . 1000 mW
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . . +300 C
Package Type
28-Pin Hermetic DIP (T)
28-Pin Plastic DIP (P)
28-Lead Hermetic Leadless Chip Carrier (TC) 70
28-Lead Plastic Leaded Chip Carrier (PC)
NOTE
*
CAUTION
1. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to
2. Digital inputs and outputs are protected, however, permanent damage may occur on unprotected units
3. Remove power before inserting or removing units from their sockets.
4. Analog outputs are protected from short circuit to ground or either supply.
T
in socket.
SS
SS
LOGIC
SS
REFH
REFH
JA
A
ET, FT, EP, FP, FPC . . . . . . . . . . . . . . . . –40 C to +85 C
AT, BT, BTC . . . . . . . . . . . . . . . . . . . . . –55 C to +125 C
the device. This is a stress rating only and functional operation at or above this specification is not
implied. Exposure to the above maximum rating conditions for extended periods may affect
device reliability.
from high-energy electrostatic fields. Keep units in conductive foam or packaging at all times until
ready to use. Use proper antistatic handling procedures.
= +25 C unless otherwise noted)
is specified for worst case mounting conditions, i. e.,
to V
to V
to V
to V
to V
to DGND . . . . . . . . . . . . . . . . . . . . . –0.3 V, +18.0 V
DD
LOGIC
REFL
DD
REFL
. . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +33.0 V
. . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +V
. . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +33.0 V
. . . . . . . . . . . . . . . . . . . . . . . . . +2.0 V, +33.0 V
. . . . . . . . . . . . . . . . . . . . . . . . +2.0 V, V
Thermal Resistance
(@ V
otherwise noted.)
DD
= +15.0 V, V
Symbol
INL
DNL
V
V
V
V
I
V
V
I
I
IN
DD
SS
ZSE
FSE
INH
INL
OH
OL
JA
is specified for device
50
48
63
JA
SS
*
LOGIC
= –15.0 V, V
7
22
28
25
JC
SS
SS
+0.3 V
15 mA
Units
–2.0 V
C/W
C/W
C/W
C/W
–V
Conditions
I
I
V
OH
OL
DD
REFH
LOGIC
= –1.6 mA
= +0.4 mA
–4–
= +2.5 V
= +5.0 V, V
REFH
= +10.0 V, V
DICE CHARACTERISTICS
DAC8412GBC
DAC8413GBC
Limit
+1
+1
+1
+1
2.4
0.8
1
2.4
0.4
12
–10
REFL
= –10.0 V, T
WARNING!
A
= +25 C unless
ESD SENSITIVE DEVICE
Units
LSB max
LSB max
LSB max
LSB max
V min
V max
V min
V max
mA max
mA min
A max
REV. C

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