LMH6555EVAL National Semiconductor, LMH6555EVAL Datasheet - Page 4

• Manufacturer Part Number: LMH6555EVAL
• Manufacturer: National Semiconductor

Specifications of LMH6555EVAL

• Lead Free Status / Rohs Status: Not Compliant

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Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications, see the Electrical Characteristics tables.
Note 2: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating
of the device such that T
T
Note 3: Total supply current is affected by the input voltages connected through R
Note 4: The maximum power dissipation is a function of T
P
mm
Note 5: Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)
Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
Note 6: Slew Rate is the average of the rising and falling edges.
Note 7: Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will
also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material.
Note 8: Limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlation using Statistical Quality
Control (SQC) methods.
Note 9: Drift determined by dividing the change in parameter at temperature extremes by the total temperature change.
Note 10: Positive current is current flowing into the device.
Note 11: Quiescent device common mode input voltage is 0.3V.
Note 12: Distortion data taken under single ended input condition.
Note 13: 0 dBm = 894 mV
Ordering Information
Connection Diagram
A
D
.
= (T
2
16-Pin LLP
copper area as shown in the “recommended land pattern” shown in the package drawing.
Package
J(MAX)
— T
A
)/ θ
JA
. All numbers apply for package soldered directly into a 2 layer PC board with zero air flow. Package should be soldered unto a 6.8
J
= T
PP
LMH6555SQE
LMH6555SQX
Part Number
LMH6555SQ
across 100Ω differential load
A
. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where T
Package Marking
J(MAX)
L6555SQ
, θ
JA
and T
16-Pin LLP
A
. The maximum allowable power dissipation at any ambient temperature is
4
S1
and R
S2
4.5k Units Tape and Reel
250 Units Tape and Reel
. Supply current tested with input removed.
1k Units Tape and Reel
Transport Media
20127705
NSC Drawing
SQA16A
J
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