GP2S24AB Sharp Electronics, GP2S24AB Datasheet - Page 10

GP2S24AB

Manufacturer Part Number
GP2S24AB
Description
Manufacturer
Sharp Electronics
Type
Reflectiver
Datasheet

Specifications of GP2S24AB

Number Of Elements
1
Output Device
Phototransistor
Reverse Breakdown Voltage
6V
Collector-emitter Voltage
35V
Forward Current
50mA
Package Type
PDIP
Collector Current (dc) (max)
20mA
Power Dissipation
100mW
Fall Time
100000ns
Rise Time
100000ns
Pin Count
4
Mounting
Through Hole
Operating Temp Range
-25C to 85C
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Not Compliant
■ Manufacturing Guidelines
● Soldering Method
● Cleaning instructions
● Presence of ODC
Flow Soldering:
Other notice
Solvent cleaning :
Ultrasonic cleaning :
Recommended solvent materials :
Soldering should be completed below 260˚C and within 5 s.
Soldering area is 1mm or more away from the bottom of housing.
Please take care not to let any external force exert on lead pins.
Please don't do soldering with preheating, and please don't do soldering by refl ow.
Please test the soldering method in actual condition and make sure the soldering works fine, since the
impact on the junction between the device and PCB varies depending on the cooling and soldering
conditions.
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Do not execute ultrasonic cleaning.
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specifi c brominated fl ame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
10
GP2S24J0000F Series
Sheet No.: D3-A01801EN

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