PC3H7CJ0000F Sharp Electronics, PC3H7CJ0000F Datasheet - Page 10

• Manufacturer Part Number: PC3H7CJ0000F
• Manufacturer: Sharp Electronics

Specifications of PC3H7CJ0000F

• Input Type: DC
• Output Type: DC
• Output Device: Transistor
• Number Of Elements: 1
• Reverse Breakdown Voltage: 6V
• Forward Voltage: 1.4V
• Forward Current: 50mA
• Collector-emitter Voltage: 80V
• Package Type: Mini Flat
• Collector Current (dc) (max): 50mA
• Isolation Voltage: 2500Vrms
• Power Dissipation: 170mW
• Collector-emitter Saturation Voltage: 0.2V
• Current Transfer Ratio: 400%
• Fall Time: 18000ns
• Rise Time: 18000ns
• Pin Count: 4
• Mounting: Surface Mount
• Operating Temp Range: -30C to 100C
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Compliant

■ Manufacturing Guidelines
● Soldering Method
Flow Soldering :
Hand soldering
Other notices
Reflow Soldering:
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 260˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
200
100
0
0
Terminal : 260˚C peak
( package surface : 250˚C peak)
1
Preheat
150 to 180˚C, 120s or less
2
10
3
Reflow
220˚C or more, 60s or less
4
PC3H7J00000F Series
(min)
Sheet No.: D2-A01902EN