TFDU6102 Vishay, TFDU6102 Datasheet - Page 9
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TFDU6102
Manufacturer Part Number
TFDU6102
Description
Manufacturer
Vishay
Type
TX/RXr
Datasheet
1.TFDU6102.pdf
(15 pages)
Specifications of TFDU6102
Data Rate
0.004kbps
Peak Wavelength
900nm
Angle Of Half Sensitivity
48°
Pulse Width
2.1us
Communication Distance
100
Led Supply Voltage
-0.5 to 6.5V
Fall Time
40ns
Rise Time
40ns
Dimensions
9.7x4.7x4
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
5.5V
Mounting
Surface Mount
Pin Count
8
Operating Temp Range
-25C to 85C
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TFDU6102
Manufacturer:
VISHAY
Quantity:
12 000
Part Number:
TFDU6102
Manufacturer:
德律风根
Quantity:
20 000
Company:
Part Number:
TFDU6102-TR1
Manufacturer:
INFINEON
Quantity:
980
Company:
Part Number:
TFDU6102-TR3
Manufacturer:
VISHAY
Quantity:
5 000
Part Number:
TFDU6102-TR3
Manufacturer:
VISHAY/威世
Quantity:
20 000
Company:
Part Number:
TFDU6102F-TR3
Manufacturer:
VISHAY
Quantity:
30 000
TFDU6102
Vishay Semiconductors
Recommended Solder Profiles for TFDU6102
Solder Profile for Sn/Pb Soldering
Lead (Pb)-Free, Recommended Solder Profile
The TFDU6102 is a lead (Pb)-free transceiver and
qualified for lead (Pb)-free processing. For lead (Pb)-
free solder paste like Sn (3.0 - 4.0) Ag (0.5 - 0.9) Cu,
there are two standard reflow profiles: Ramp-Soak-
Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-
Soak-Spike profile was developed primarily for reflow
ovens heated by infrared radiation. With widespread
use of forced convection reflow ovens the Ramp-To-
Spike profile is used increasingly. Shown below in fig-
ure 4 and 5 are VISHAY's recommended profiles for
use with the TFDU6102 transceivers. For more
details please refer to the application note
“SMD Assembly Instructions”
(http://www.vishay.com/docs/82602/82602.pdf).
A ramp-up rate less than 0.9 °C/s is not recom-
mended. Ramp-up rates faster than 1.3 °C/s could
damage an optical part because the thermal conduc-
tivity is less than compared to a standard IC.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be rec-
ommended because the risk of damage is highly
dependent on the experience of the operator. Never-
theless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
www.vishay.com
290
19535
Figure 3. Recommended Solder Profile for Sn/Pb soldering
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
2...4 °C/s
50
100
160 °C max.
120 s...180 s
240 °C max.
150
Time/s
200
2...4 °C/s
10 s max. at 230 °C
90 s max.
250
300
350
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equiva-
lent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
19532
280
260
240
220
200
180
160
140
120
100
275
250
225
200
175
150
125
100
80
60
40
20
75
50
25
0
0
0
0
Figure 4. Solder Profile, RSS Recommendation
2 °C...3 °C/s
50
50
T ≥ 217 °C for 70 s max
T ≥ 255 °C for 10 s....30 s
Figure 5. RTS Recommendation
100
1.3 °C/s
100
90 s...120 s
T
peak
Time above 217 °C t ≤ 70 s
Time above 250 °C t ≤ 40 s
Peak temperature T
= 260 °C max
150
Time/s
Time/s
150
peak
200
= 260 °C
Document Number 82550
70 s max.
30 s max.
200
< 4 °C/s
250
Rev. 1.7, 21-Aug-06
T peak = 260 °C
< 2 °C/s
2 °C...4 °C/s
250
300
350
300