MT16JTF25664AZ-1G4F1 Micron Technology Inc, MT16JTF25664AZ-1G4F1 Datasheet - Page 10

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MT16JTF25664AZ-1G4F1

Manufacturer Part Number
MT16JTF25664AZ-1G4F1
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT16JTF25664AZ-1G4F1

Main Category
DRAM Module
Module Type
240UDIMM
Device Core Size
64b
Organization
256Mx64
Total Density
17179869184
Number Of Elements
8
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
240
Mounting
Socket
Lead Free Status / Rohs Status
Compliant
DRAM Operating Conditions
Table 10:
Design Considerations
Simulations
Power
PDF: 09005aef837cdd2d/Source: 09005aef837cdc74
JTF16C_256_512x64AZ.fm - Rev. A 2/09 EN
Module and Component Speed Grades
DDR3 components must be able to meet or exceed the listed speed grade.
Recommended AC operating conditions are given in the DDR3 component data sheets.
Component specifications are available on Micron’s Web site. Module speed grades
correlate with component speed grades, as shown in Table 10.
Micron memory modules are designed to optimize signal integrity through carefully
designed terminations, controlled board impedances, routing topologies, trace length
matching, and decoupling. However, good signal integrity starts at the system level.
Micron encourages designers to simulate the signal characteristics of the system’s
memory bus to ensure adequate signal integrity of the entire memory system.
Operating voltages are specified at the DRAM, not at the edge connector of the module.
Designers must account for any system voltage drops at anticipated power levels to
ensure the required supply voltage is maintained.
Module Speed Grade
-1G6
-1G4
-1G1
-1G0
-80C
-80B
2GB, 4GB (x64, DR): 240-Pin DDR3 SDRAM UDIMM
10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Component Speed Grade
Electrical Specifications
©2008 Micron Technology, Inc. All rights reserved.
-187E
-125
-15E
-187
-25E
-25

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