MT45W2MW16PAFA85WT Micron Technology Inc, MT45W2MW16PAFA85WT Datasheet - Page 24
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MT45W2MW16PAFA85WT
Manufacturer Part Number
MT45W2MW16PAFA85WT
Description
Manufacturer
Micron Technology Inc
Datasheet
1.MT45W2MW16PAFA85WT.pdf
(27 pages)
Specifications of MT45W2MW16PAFA85WT
Operating Temperature (max)
85C
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Not Compliant
NOTE:
Data Sheet Designation: ADVANCE
ucts still in development.
09005aef80d481d3
AsyncCellularRAM_16_32.fm - Rev. A 2/18/04 EN
1. All dimensions in millimeters, MAX/MIN or typical where noted.
2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side.
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-REFLOW
DIAMETER IS Ø0.35.
E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
SEATING PLANE
This data sheet contains initial descriptions of prod-
CellularRAM is a trademark of Micron Technology, Inc. inside the U.S. and a trademark of Infineon Technologies outside the U.S.
5.25
48X Ø0.35
0.10 C
2.625 ±0.05
BALL A6
0.70 ±0.05
C
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
Micron, and the Micron and M Logos are trademarks of Micron Technology, Inc.
1.875 ±0.050
All other trademarks are the property of their respective owners.
6.00 ±0.10
0.75
TYP
3.75
C L
3.00 ±0.05
Figure 21: 48-Ball FBGA
0.75 TYP
C L
4.00 ±0.05
BALL A1
BALL A1 ID
ASYNC/PAGE CellularRAM MEMORY
24
8.00 ±0.10
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
2 MEG x 16, 1 MEG x 16
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag or
96.5% Sn, 3% Ag, 0.5% Cu
SOLDER BALL PAD: Ø0.30 SOLDER MASK DEFINED
SUBSTRATE: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
©2004 Micron Technology, Inc. All Rights Reserved.
BALL A1 ID
ADVANCE