BLA31AG601SN4D Murata, BLA31AG601SN4D Datasheet - Page 4

BLA31AG601SN4D

Manufacturer Part Number
BLA31AG601SN4D
Description
Manufacturer
Murata
Type
Chip Beadr
Datasheet

Specifications of BLA31AG601SN4D

Inductance
Not RequireduH
Core Material
Ferrite
Impedance
600Ohm
Tolerance (+ Or -)
25%
Dc Resistance
350mOhm
Case Size (inches)
1206in
Operating Temp Range
-55C to 125C
Test Frequency
100MHz
Dc Current
100mA
Product Diameter (mm)
Not Requiredmm
Product Height (mm)
0.8mm
Product Depth (mm)
1.6mm
Product Length (mm)
3.2mm
Military Standard
Not Required
Failure Rate
Not Required
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BLA31AG601SN4D
Manufacturer:
MURATA
Quantity:
8 000
Part Number:
BLA31AG601SN4D
Manufacturer:
MURATA
Quantity:
8 000
Part Number:
BLA31AG601SN4D
Manufacturer:
MURATA/村田
Quantity:
20 000
I Impedance-Frequency Characteristics
I !Caution/Notice
! Note:
1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our
2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product
o
!Caution (Rating)
products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.
specifications or transact the approval sheet for product specifications before ordering.
Continued from the preceding page.
This data sheet is applied for CHIP FERRITE BEAD used for General Electronics equipment for your design.
Do not use products beyond the rated current as
this may create excessive heat and deteriorate
the insulation resistance.
2000
1500
1000
500
0
1
BLA31BD102SN4
10
Frequency (MHz)
100
Z
R
X
Noise Suppression Products/EMI Suppression Filters > EMIFILr (Inductor type) > Chip Ferrite Bead (Array)
1000
3000
http://www.murata.com/
Data Sheet
Notice
Solderability of Tin plating termination chip might be
deteriorated when low temperature soldering profile
where peak solder temperature is below the Tin melting
point is used. Please confirm the solderability of Tin
plating termination chip before use.
2009.5.1
4

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