AD9742ARURL7 Analog Devices Inc, AD9742ARURL7 Datasheet - Page 30

• Manufacturer Part Number: AD9742ARURL7
• Description: IC DAC 12BIT 210MSPS 28-TSSOP
• Manufacturer: Analog Devices Inc
• Series: TxDAC®r

Specifications of AD9742ARURL7

• Rohs Status: RoHS non-compliant
• Settling Time: 11ns
• Number Of Bits: 12
• Data Interface: Parallel
• Number Of Converters: 1
• Voltage Supply Source: Analog and Digital
• Power Dissipation (max): 145mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-TSSOP
• For Use With: AD9742ACP-PCBZ - BOARD EVAL FOR AD9742ACP

AD9742
ORDERING GUIDE
Models
AD9742AR
AD9742ARRL
AD9742ARZ
AD9742ARZRL
AD9742ARU
AD9742ARURL7
AD9742ARUZ
AD9742ARUZRL7
AD9742ACP
AD9742ACPRL7
AD9742ACPZ
AD9742ACPZRL7
AD9742-EB
AD9742ACP-PCB
1
2
R = Small Outline IC; RU = Thin Shrink Small Outline Package; CP = Lead Frame Chip Scale Package.
Z = Pb-free part.
2
2
2
2
2
2
1.00
0.85
0.80
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
12° MAX
SEATING
PLANE
BSC SQ
PIN 1
INDICATOR
VIEW
5.00
TOP
Figure 57. 32-Lead Lead Frame Chip Scale Package [LFCSP]
0.80 MAX
0.65 TYP
0.30
0.23
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
Dimensions shown in millimeters
BSC SQ
0.20 REF
5 mm × 5 mm Body (CP-32-2)
4.75
Rev. B | Page 30 of 32
0.05 MAX
0.02 NOM
Package Description
28-Lead 300-Mil SOIC
28-Lead 300-Mil SOIC
28-Lead 300-Mil SOIC
28-Lead 300-Mil SOIC
28-Lead TSSOP
28-Lead TSSOP
28-Lead TSSOP
28-Lead TSSOP
32-Lead LFCSP
32-Lead LFCSP
32-Lead LFCSP
32-Lead LFCSP
Evaluation Board (SOIC)
Evaluation Board (LFCSP)
0.60 MAX
COPLANARITY
BSC
0.50
0.50
0.40
0.30
0.08
17
24
16
25
0.60 MAX
BOTTOM
VIEW
32
9
1
8
3.50 REF
3.25
3.10 SQ
2.95
PIN 1
INDICATOR
0.25 MIN
Package Options
R-28
R-28
R-28
R-28
RU-28
RU-28
RU-28
RU-28
CP-32-2
CP-32-2
CP-32-2
CP-32-2
1