LTC2641CS8-16#TRPBF Linear Technology, LTC2641CS8-16#TRPBF Datasheet - Page 20
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LTC2641CS8-16#TRPBF
Manufacturer Part Number
LTC2641CS8-16#TRPBF
Description
IC DAC 16BIT VOUT 8-SOIC
Manufacturer
Linear Technology
Datasheet
1.LTC2642CDD-12PBF.pdf
(24 pages)
Specifications of LTC2641CS8-16#TRPBF
Settling Time
1µs
Number Of Bits
16
Data Interface
Serial
Number Of Converters
1
Voltage Supply Source
Single Supply
Power Dissipation (max)
600µW
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
LTC2641/LTC2642
PACKAGE DESCRIPTION
20
3.50 ±0.05
2.15 ±0.05
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.25 ± 0.05
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
TOP AND BOTTOM OF PACKAGE
1.65 ±0.05
(2 SIDES)
2.38 ±0.05
(2 SIDES)
0.50
BSC
0.675 ±0.05
PACKAGE
OUTLINE
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
(SEE NOTE 6)
TOP MARK
PIN 1
DD Package
0.200 REF
0.75 ±0.05
3.00 ±0.10
(4 SIDES)
0.00 – 0.05
1.65 ± 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
5
R = 0.115
6
2.38 ±0.10
(2 SIDES)
TYP
10
1
0.50 BSC
0.25 ± 0.05
0.38 ± 0.10
(DD) DFN 1103
26412fb