LTC2634IMSE-HMI12#PBF Linear Technology, LTC2634IMSE-HMI12#PBF Datasheet - Page 2

• Manufacturer Part Number: LTC2634IMSE-HMI12#PBF
• Description: IC DAC 12BIT QUAD VOUT 10-MSOP
• Manufacturer: Linear Technology

Specifications of LTC2634IMSE-HMI12#PBF

• Settling Time: 4.2µs
• Number Of Bits: 12
• Data Interface: MICROWIRE™, Serial, SPI™
• Number Of Converters: 4
• Voltage Supply Source: Single Supply
• Power Dissipation (max): 1.8mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-MSOP Exposed Pad, 10-HMSOP, 10-eMSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

aBsolute maximum ratings
LTC2634
Supply Voltage (V
CS/LD, SCK, SDI, LDAC, CLR, SDO, REFLO.. –0.3V to 6V
V
REF .................................. –0.3V to Min (V
Operating Temperature Range
pin conFiguration

OUTA
LTC2634C ................................................ 0°C to 70°C
LTC2634I.............................................. –40°C to 85°C
LTC2634H (Note 3) ............................ –40°C to 125°C
-V
OUTD
EXPOSED PAD (PIN 17) IS GND, MUST BE SOLDERED TO PCB
.................... –0.3V to Min (V
V
V
CS/LD
LDAC
16-LEAD (3mm 3mm) PLASTIC QFN
OUTA
OUTB
CC
) ................................... –0.3V to 6V
T
JMAX
1
2
3
4
16 15 14 13
5
= 125°C, θ
UD PACKAGE
TOP VIEW
6
17
7
JA
= 68°C/W
8
12
11
10
9
V
V
REF
CLR
OUTD
OUTC
CC
CC
+ 0.3V, 6V)
+ 0.3V, 6V)
(Notes 1, 2)
Maximum Junction Temperature........................... 150°C
Storage Temperature Range ................... –65°C to 150°C
Lead Temperature (Soldering, 10 sec)
MSOP ............................................................... 300°C
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB
V
V
CS/LD
OUTB
OUTA
SCK
V
CC
T
10-LEAD PLASTIC MSOP
JMAX
1
2
3
4
5
MSE PACKAGE
= 125°C, θ
TOP VIEW
11
JA
= 35°C/W
10
9
8
7
6
GND
V
V
REF
SDI
OUTD
OUTC
2634fc