AD5762RCSUZ Analog Devices Inc, AD5762RCSUZ Datasheet - Page 10

IC DAC DUAL 16BIT 1LSB 32-TQFP

AD5762RCSUZ

Manufacturer Part Number
AD5762RCSUZ
Description
IC DAC DUAL 16BIT 1LSB 32-TQFP
Manufacturer
Analog Devices Inc
Datasheet

Specifications of AD5762RCSUZ

Data Interface
Serial
Settling Time
8µs
Number Of Bits
16
Number Of Converters
2
Voltage Supply Source
Analog and Digital, Dual ±
Power Dissipation (max)
180mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
32-TQFP, 32-VQFP
Resolution (bits)
16bit
Sampling Rate
84.6MSPS
Input Channel Type
Serial
Supply Voltage Range - Digital
2.7V To 5.25V
Supply Current
4.25mA
Digital Ic Case Style
QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AD5762RCSUZ
Manufacturer:
Analog Devices Inc
Quantity:
10 000
Part Number:
AD5762RCSUZ-REEL7
Manufacturer:
Analog Devices Inc
Quantity:
10 000
AD5762R
ABSOLUTE MAXIMUM RATINGS
T
100 mA do not cause SCR latch-up.
Table 4.
Parameter
AV
AV
DV
Digital Inputs to DGND
Digital Outputs to DGND
REFx to AGND, PGND
REFOUT to AGND
TEMP
VOUTx to AGND
AGND to DGND
Operating Temperature Range
Storage Temperature Range
Junction Temperature (T
Lead Temperature (Soldering)
A
Industrial
DD
SS
CC
= 25°C unless, otherwise noted. Transient currents of up to
to AGND, DGND
to AGND, DGND
to DGND
J
max)
Rating
−0.3 V to +17 V
+0.3 V to −17 V
−0.3 V to +7 V
−0.3 V to (DV
whichever is less
−0.3 V to DV
−0.3 V to AV
AV
AV
AV
−0.3 V to +0.3 V
−40°C to +85°C
−65°C to +150°C
150°C
JEDEC Industry Standard
J-STD-020
SS
SS
SS
to AV
to AV
to AV
DD
DD
DD
DD
CC
CC
+ 0.3 V
+ 0.3 V
+ 0.3 V) or +7 V,
Rev. A | Page 10 of 32
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type
32-Lead TQFP
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
θ
65
JA
θ
12
JC
Unit
°C/W

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